Bointec Co., Ltd.

Bointec is the brand of Taijet Bointec Corporation Limited (鈦捷科技股份有限公司), a Taiwan-based developer of wireless networking hardware and communication solutions. The product catalog is organized into five categories: Wi-Fi, 3G/4G, Converter, Antenna & Accessories, and Bluetooth. These are module-level products built around third-party silicon rather than in-house chips — current parts include Wi-Fi 6 modules on the Qualcomm QCA2066 (DGF307A) and Realtek RTL8852BE (DGF307R) in M.2 2230 and miniPCIe form factors, Wi-Fi 5 combo cards on the QCA6174A-5, USB dongles in the CUB series, Bluetooth 5.x dongles in the BUB series, and PCB antennas. They’re designed to drop into embedded systems and industrial computing platforms; documented end applications include European public transportation vehicles and vehicle computers built as OEM work for a Canadian industrial PC company.

Alongside hardware, Bointec runs a design and production-coordination business rather than owning fabrication. It offers OEM, ODM, EMS and engineering design services, with the distinction resting on whether the customer or Bointec handles specification and development, and describes its role as helping conduct production engineering to factory manufacturing. Its embedded team works on ARM9/ARM11 and MIPS platforms, covering circuit design, BSP bring-up, embedded OS work, and TCP/IP and 3G/4G HSPA protocol stacks. Named solution areas are Wi-Fi client connectivity, IoT control, utilities meter automation, long-distance RF, and Wi-Fi signal enhancement.