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Total Products: 4
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AFC51E08SQP1A (2A)ESMT64Gb Memory Ind.eMMC Memory153 ball BGA2.5V-40°C – 85°C
Memory Size:
64 Gbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
eMMC
Memory Organization:
8G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Qualification:
N/A
Packaging:
153 ball BGA
135
N/AFC51J32SJTS2A (2D)ESMT256Gb Memory Ind.eMMC Memory153 ball BGA2.5V-40°C – 85°C
Memory Size:
256 Gbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
eMMC
Memory Organization:
32G x 8
Memory Interface:
eMMC 5.1
Grade:
Industrial
Qualification:
N/A
Packaging:
153 ball BGA
293
N/AFC51J32SJTS2A-2.5BWGE2DESMTeMMC Flash 3.3V 32 GByte - eMMC Flash MemoryeMMC Memory153-ball BGA2.7 V to 3.6 V-25°C to +85°C
JEDEC Standard:
eMMC Electrical Standard 5.1
LBA (Hex/ Dec):
0x039EC000 / 60,735,488
Bus Width:
 1-bit (default), 4-bit, 8-bit
Max Clock Speed Ordering:
 200 MHz (Ordering table); HS200/HS400 timing tables included
Sequential Read (HS400, 8-Bit):
 250 MB/s
Sequential Write (HS400, 8-Bit):
 210 MB/s
Memory Size:
 32 GB (31,096,569,856 bytes)
Memory Type:
eMMC Flash Memory
Operating Temperature:
 -25°C to +85°C
I/O Supply (VCCQ):
 1.70 – 1.95 V or 2.7 – 3.6 V
Storage Temperature:
 -40°C to +85°C
Boot Partition 1:
 4096 KB
Boot Partition 2:
 4096 KB
RPMB:
 4096 KB
Large Sector Size Support:
Not supported (4 KB)
Package:
 153-ball BGA
Package Dimensions:
 11.5 mm x 13.0 mm body; max height 1.0 mm
Ball Pitch:
 0.50 mm (BSC)
Pb Free:
 Yes (per ordering info)
1,797
N/AFC51J32SJTS2A-2.5BWGI2DESMTeMMC Flash 3.3V 32 GByte - eMMC Flash MemoryeMMC Memory153-ball BGA2.7 V to 3.6 V-40°C to +85°C
JEDEC Standard:
eMMC Electrical Standard 5.1
LBA (Hex/ Dec):
0x039EC000 / 60,735,488
Bus Width:
1-bit (default), 4-bit, 8-bit
Max Clock Speed Ordering:
200 MHz (Ordering table); HS200/HS400 timing tables included
Sequential Read (HS400, 8-Bit):
250 MB/s
Sequential Write (HS400, 8-Bit):
210 MB/s
Memory Size:
32 GB (31,096,569,856 bytes)
Memory Type:
eMMC Flash Memory
Operating Temperature:
-40°C to +85°C
I/O Supply (VCCQ):
1.70 – 1.95 V or 2.7 – 3.6 V
Storage Temperature:
-40°C to +85°C
Boot Partition 1:
4096 KB
Boot Partition 2:
4096 KB
RPMB:
4096 KB
Large Sector Size Support:
Not supported (4 KB)
Package:
153-ball BGA
Package Dimensions:
11.5 mm x 13.0 mm body; max height 1.0 mm
Ball Pitch:
0.50 mm (BSC)
Pb Free:
 Yes (per ordering info)
296

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