 | | EMMC64G-IY29-5B102 | Kingston Technology | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | N/A | -40°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 803 | |
 | | EMMC64G-IY29-5B111 | Kingston Technology | IC FLSH 512GBIT EMMC 5.1 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | N/A | -40°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 430 | |
| N/A | | EMMC64G-TB9F-03B11 | Kingston Technology | IC FLASH 256GBIT EMMC 153VFBGA | eMMC Memory | 153-FBGA (8x8.5) | 2.7V ~ 3.6V | -25°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 370 | |
 | | EMMC64G-TY29-5B101 | Kingston Technology | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | N/A | -25°C ~ 85°C | Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 1,435 | |
 | | EMMC64G-TY29-5B102 | Kingston Technology | IC FLASH 512GBIT EMMC 153FBGA | eMMC Memory | 153-FBGA (11.5x13) | 2.7V ~ 3.6V | -25°C ~ 85°C | Memory Interface: eMMC_5.1 Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 208 | |
 | | EMMC64G-TY29-5B111 | Kingston Technology | IC FLASH 512GBIT EMMC 153WFBGA | eMMC Memory | 153-FBGA (11.5x13) | 1.8V, 3.3V | -25°C ~ 85°C | Memory Organization: 64G x 8 Technology: FLASH - NAND (TLC) Write Cycle Time Word Page: N/A | 794 | |
| N/A | | FC51E08SQP1A (2A) | ESMT | 64Gb Memory Ind. | eMMC Memory | 153 ball BGA | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: N/A Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 | 135 | |
| N/A | | FC51J32SJTS2A (2D) | ESMT | 256Gb Memory Ind. | eMMC Memory | 153 ball BGA | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: N/A Memory Organization: 32G x 8 Memory Interface: eMMC 5.1 | 293 | |
| N/A | | FC51J32SJTS2A-2.5BWGE2D | ESMT | eMMC Flash 3.3V 32 GByte - eMMC Flash Memory | eMMC Memory | 153-ball BGA | 2.7 V to 3.6 V | -25°C to +85°C | JEDEC Standard: eMMC Electrical Standard 5.1 LBA (Hex/ Dec): 0x039EC000 / 60,735,488 Bus Width: 1-bit (default), 4-bit, 8-bit Max Clock Speed Ordering: 200 MHz (Ordering table); HS200/HS400 timing tables included Sequential Read (HS400, 8-Bit): 250 MB/s Sequential Write (HS400, 8-Bit): 210 MB/s Memory Size: 32 GB (31,096,569,856 bytes) Memory Type: eMMC Flash Memory Operating Temperature: -25°C to +85°C I/O Supply (VCCQ): 1.70 – 1.95 V or 2.7 – 3.6 V Storage Temperature: -40°C to +85°C Boot Partition 1: 4096 KB Boot Partition 2: 4096 KB Large Sector Size Support: Not supported (4 KB) Package Dimensions: 11.5 mm x 13.0 mm body; max height 1.0 mm Ball Pitch: 0.50 mm (BSC) Pb Free: Yes (per ordering info) | 1,797 | |
| N/A | | FC51J32SJTS2A-2.5BWGI2D | ESMT | eMMC Flash 3.3V 32 GByte - eMMC Flash Memory | eMMC Memory | 153-ball BGA | 2.7 V to 3.6 V | -40°C to +85°C | JEDEC Standard: eMMC Electrical Standard 5.1 LBA (Hex/ Dec): 0x039EC000 / 60,735,488 Bus Width: 1-bit (default), 4-bit, 8-bit Max Clock Speed Ordering: 200 MHz (Ordering table); HS200/HS400 timing tables included Sequential Read (HS400, 8-Bit): 250 MB/s Sequential Write (HS400, 8-Bit): 210 MB/s Memory Size: 32 GB (31,096,569,856 bytes) Memory Type: eMMC Flash Memory Operating Temperature: -40°C to +85°C I/O Supply (VCCQ): 1.70 – 1.95 V or 2.7 – 3.6 V Storage Temperature: -40°C to +85°C Large Sector Size Support: Not supported (4 KB) Package Dimensions: 11.5 mm x 13.0 mm body; max height 1.0 mm Pb Free: Yes (per ordering info) | 296 | |
 | | FEMC004GPA-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Qualification: AEC-Q100 Grade 3 | 1,012 | |
 | | FEMC004GPB-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 Qualification: AEC-Q100 Grade 2 | 872 | |
 | | FEMC004GPE-E430 | Flexxon | XTRA III 5.1 100ball eMMC (MLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 | 741 | |
 | | FEMC004GPE-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 | 512 | |
 | | FEMC004GPG-E430 | Flexxon | XTRA III 5.1 100ball eMMC (MLC/3D pSLC) | eMMC Memory | 100-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 | 128 | |
 | | FEMC004GPG-E440 | Flexxon | XTRA III 5.1 153ball eMMC (MLC/pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 4G x 8 Memory Interface: eMMC 5.1 | 973 | |
 | | FEMC008G-M10 | Flexxon | ECON II 5.1 153ball eMMC (3D TLC/MLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 | 765 | |
 | | FEMC008GBE-T740 | Flexxon | XTRA VII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -25°C - 85°C | Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 | 925 | |
 | | FEMC008GCA-T740 | Flexxon | XTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -40°C - 85°C | Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 Qualification: AEC-Q100 Grade 3 | 262 | |
 | | FEMC008GCB-T740 | Flexxon | XTRA VIII 5.1 153ball eMMC (3D TLC/3D pSLC) | eMMC Memory | 153-FBGA | VCCQ: 1.8V/3.3V VCC: 3.3V | -40°C - 105°C | Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 Qualification: AEC-Q100 Grade 2 | 502 | |