 | | W25X64VSFIG | Winbond Electronics | IC FLASH 64MBIT SPI 75MHZ 16SOIC | Flash Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Write Cycle Time Word Page: 3 ms | 15 | |
 | | W25X64VZEIG | Winbond Electronics | IC FLASH 64MBIT SPI 75MHZ 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: 3 ms | 1,338 | |
 | | W35T25NWSFIE | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 174 | |
 | | W35T25NWSFIE TR | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 362 | |
 | | W35T25NWSFIF | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 462 | |
 | | W35T25NWSFIF TR | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 1,727 | |
| N/A | | W35T25NWTBIE | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 49 | |
| N/A | | W35T25NWTBIF | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 320 | |
| N/A | N/A | W35T51NWTBIE | Winbond Electronics | OCTALFLASH, 512M-BIT, 4KB UNIFOR | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 174 | |
| N/A | N/A | W35T51NWTBIE TR | Winbond Electronics | OCTALFLASH, 512M-BIT, 4KB UNIFOR | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 616 | |
| N/A | | W35T51NWTBIF | Winbond Electronics | OCTAL FLASH, 1.8V, 512M-BIT | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 1,030 | |
| N/A | | W35T51NWTBIF TR | Winbond Electronics | OCTAL FLASH, 1.8V, 512M-BIT | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 64M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 706 | |
 | | W74M12FVSSIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Flash Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 940 | |
 | | W74M12FVSSIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Flash Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 662 | |
 | | W74M12FVZPIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (6x5) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 931 | |
 | | W74M12FVZPIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (6x5) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: N/A | 1,588 | |
 | N/A | W74M12JVSSIQ | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Flash Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: 3 ms | 1,155 | |
 | N/A | W74M12JVSSIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Flash Memory | 8-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O, QPI Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: 3 ms | 681 | |
 | | W74M12JWSSIQ | Winbond Electronics | IC FLASH 128MBIT 104MHZ 8SOIC | Flash Memory | 8-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 1,081 | |
 | | W74M12JWSSIQ TR | Winbond Electronics | IC FLASH 128MBIT SPI/QUAD 8SOIC | Flash Memory | 8-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 16M x 8 Packaging: 8-SOIC (0.209", 5.30mm Width) Write Cycle Time Word Page: N/A | 542 | |