| N/A | N/A | FM6BD2G2GXA2L | ESMT | 2Gb NAND+LPDDR2 MCP Ind. | Flash Memory | 10.5x8 (mm),162ball | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 95 | |
| N/A | N/A | FM6BD4G2GXB(2V) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 303 | |
| N/A | N/A | FM6BD4G4GKMA (2J) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 12 | |
| N/A | N/A | FM6BD4G4GXMB (2V) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 784 | |
| N/A | N/A | FM6HZ4G4GXB | ESMT | 4Gb NAND+LPDDR4x MCP | Flash Memory | 9.5x8 (mm),149ball | 2.5V | 0°C – 70°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 256M x 16 Memory Interface: Parallel Packaging: 9.5x8 (mm),149ball | 809 | |
| N/A | N/A | FM6HZ8G8GKDZA (2R) | ESMT | 8Gb NAND+LPDDR4x MCP Auto. | Flash Memory | 9.5x8 (mm),149ball | 2.5V | -40°C – 105°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 256M x 16 x 2 die Memory Interface: Parallel Packaging: 9.5x8 (mm),149ball | 1,509 | |
 | N/A | IS21EF04GP-BCLI | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 647 | |
 | N/A | IS21EF04GP-BCLI-TR | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 446 | |
 | N/A | IS21EF04GP-JCLI | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, ROHS, | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 1,365 | |
 | N/A | IS21EF04GP-JCLI-TR | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, ROHS, | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 89 | |
 | N/A | IS21EF04GP-JQLI | Integrated Silicon Solution Inc | 4GB, 100 BALL FBGA, 3.3V, ROHS, | Flash Memory | 100-LFBGA (14x18) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 608 | |
 | N/A | IS21EF04GP-JQLI-TR | Integrated Silicon Solution Inc | 4GB, 100 BALL FBGA, 3.3V, ROHS, | Flash Memory | 100-LFBGA (14x18) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 1,084 | |
 | N/A | IS21EF08G-BCLI | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 1,609 | |
 | N/A | IS21EF08G-BCLI-TR | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 319 | |
 | N/A | IS21EF08G-JCLI | Integrated Silicon Solution Inc | IC FLASH 64MBIT EMMC 153FBGA | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 1,470 | |
 | N/A | IS21EF08G-JCLI-TR | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, ROHS, | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 674 | |
 | N/A | IS21EF08G-JQLI-TR | Integrated Silicon Solution Inc | 8GB, 100 BALL FBGA, 3.3V, ROHS, | Flash Memory | 100-LFBGA (14x18) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 609 | |
 | N/A | IS21EF08GP-BCLI | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 688 | |
 | N/A | IS21EF08GP-BCLI-TR | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 526 | |
 | N/A | IS21EF08GP-JCLI | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, ROHS, | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 14 | |