 | | W25N512GWEIT | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,646 | |
 | | W25N512GWEIT TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (8x6) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 26 | |
 | | W25N512GWFIR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Flash Memory | 16-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 185 | |
 | | W25N512GWFIR TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Flash Memory | 16-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 517 | |
 | | W25N512GWFIT | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Flash Memory | 16-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 980 | |
 | | W25N512GWFIT TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 16SOIC | Flash Memory | 16-SOIC | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 106 | |
 | | W25N512GWPIR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 987 | |
 | | W25N512GWPIR TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 1,551 | |
 | | W25N512GWPIT | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 293 | |
 | | W25N512GWPIT TR | Winbond Electronics | IC FLASH 512MBIT SPI/QUAD 8WSON | Flash Memory | 8-WSON (6x5) | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 8-WDFN Exposed Pad Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 154 | |
 | | W25N512GWYIR TR | Winbond Electronics | IC FLASH 512MBIT SPI 48WLCSP | Flash Memory | 48-WLCSP | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 48-UFBGA, WLCSP Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 670 | |
 | | W25N512GWYIT TR | Winbond Electronics | IC FLASH 512MBIT SPI 48WLCSP | Flash Memory | 48-WLCSP | 1.7V ~ 1.95V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Quad I/O Memory Organization: 64M x 8 Packaging: 48-UFBGA, WLCSP Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 700 μs | 255 | |
 | | W25X64VSFIG | Winbond Electronics | IC FLASH 64MBIT SPI 75MHZ 16SOIC | Flash Memory | 16-SOIC | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Write Cycle Time Word Page: 3 ms | 15 | |
 | | W25X64VZEIG | Winbond Electronics | IC FLASH 64MBIT SPI 75MHZ 8WSON | Flash Memory | 8-WSON (8x6) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Organization: 8M x 8 Packaging: 8-WDFN Exposed Pad Write Cycle Time Word Page: 3 ms | 1,338 | |
 | | W35T25NWSFIE | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 174 | |
 | | W35T25NWSFIE TR | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 362 | |
 | | W35T25NWSFIF | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 462 | |
 | | W35T25NWSFIF TR | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 16-SOIC | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Packaging: 16-SOIC (0.295", 7.50mm Width) Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 1,727 | |
| N/A | | W35T25NWTBIE | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 49 | |
| N/A | | W35T25NWTBIF | Winbond Electronics | OCTAL FLASH, 1.8V, 256M-BIT | Flash Memory | 24-TFBGA (8x6) | 1.65V ~ 2V | -40°C ~ 85°C (TA) | Memory Interface: SPI - Octal I/O Memory Organization: 32M x 8 Technology: FLASH - NAND (SLC) Write Cycle Time Word Page: 1.5 ms | 320 | |