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Total Products: 24,739
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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DSPIC33EP512GM710-H/BG
DSPIC33EP512GM710-H/BGMicrochip TechnologyIC MCU 16BIT 512KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
546
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DSPIC33EP512GM710-H/PF
DSPIC33EP512GM710-H/PFMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,287
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DSPIC33EP512GM710-H/PT
DSPIC33EP512GM710-H/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
969
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DSPIC33EP512GM710-I/BG
DSPIC33EP512GM710-I/BGMicrochip TechnologyIC MCU 16BIT 512KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
525
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DSPIC33EP512GM710-I/PF
DSPIC33EP512GM710-I/PFMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,220
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DSPIC33EP512GM710-I/PT
DSPIC33EP512GM710-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,418
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DSPIC33EP512GM710T-I/BG
DSPIC33EP512GM710T-I/BGMicrochip TechnologyIC MCU 16BIT 512KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
243
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DSPIC33EP512GM710T-I/PF
DSPIC33EP512GM710T-I/PFMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
552
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DSPIC33EP512GM710T-I/PT
DSPIC33EP512GM710T-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
427
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DSPIC33EP512GP502-E/MM
DSPIC33EP512GP502-E/MMMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
742
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DSPIC33EP512GP502-E/SO
DSPIC33EP512GP502-E/SOMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,375
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DSPIC33EP512GP502-E/SP
DSPIC33EP512GP502-E/SPMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28SPDIPMicrocontrollers28-SPDIPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Through Hole
Supplier Device Package:
28-SPDIP
Package / Case:
28-DIP (0.300″”, 7.62mm)
766
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DSPIC33EP512GP502-H/MM
DSPIC33EP512GP502-H/MMMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
1,832
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DSPIC33EP512GP502-H/SO
DSPIC33EP512GP502-H/SOMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,323
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DSPIC33EP512GP502-H/SP
DSPIC33EP512GP502-H/SPMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28SPDIPMicrocontrollers28-SPDIPN/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Through Hole
Supplier Device Package:
28-SPDIP
Package / Case:
28-DIP (0.300″”, 7.62mm)
831
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DSPIC33EP512GP502-I/MM
DSPIC33EP512GP502-I/MMMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
1,146
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DSPIC33EP512GP502-I/SO
DSPIC33EP512GP502-I/SOMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
133
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DSPIC33EP512GP502-I/SP
DSPIC33EP512GP502-I/SPMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28SPDIPMicrocontrollers28-SPDIPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-SPDIP
Package / Case:
28-DIP (0.300″”, 7.62mm)
84
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DSPIC33EP512GP502T-E/MM
DSPIC33EP512GP502T-E/MMMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
914
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DSPIC33EP512GP502T-E/SO
DSPIC33EP512GP502T-E/SOMicrochip TechnologyIC MCU 16BIT 512KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
24K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,462
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