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Total Products: 18,739
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
D13002FI16V
D13002FI16VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
72
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D13002FP16V
D13002FP16VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,097
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N/A
D13002VF10VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
10MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,121
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D13002X16V
D13002X16VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Peripherals:
DMA, PWM, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
526
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D13003RF10V
D13003RF10VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
10MHz
Connectivity:
SCI
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
404
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D13004F16V
D13004F16VRenesasMCU H8/300H / H8/3002MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
792
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D13007FI20VN/AD13007FI20VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
329
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D13007VFI13VN/AD13007VFI13VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
304
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D13008F25V
D13008F25VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
918
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D13008FBL25V
D13008FBL25VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
1,744
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D13008VF25V
D13008VF25VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
1,592
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D13008VFBL25V
D13008VFBL25VRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
PWM, WDT
Number of I/O:
35
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
620
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D17618ABGW100V
D17618ABGW100VRenesasIC MCU 32BIT ROMLESS 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
Ethernet, Host Interface, FIFO, SCI
Peripherals:
DMA, POR, WDT
Number of I/O:
71
Program Memory Type:
ROMless
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
841
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D17709SHF167BDV
D17709SHF167BDVRenesas32-BIT, FLASH SUPERH SH7709 CPUMicrocontrollersN/AN/AN/A

N/A

299
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D17760BP200ADV
D17760BP200ADVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
526
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N/AN/AD32375WA36FQVRenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

482
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N/A
D6417709SBP100BVRenesasMCU 32-BIT SUPERH RISC ROMLESSMicrocontrollersN/AN/AN/A
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Program Memory Type:
ROMless
RAM Size:
16K x 8
Data Converters:
A/D 8x10b; D/A 2x8b
799
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D6417709SBP133BV
D6417709SBP133BVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 2.05V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
682
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D6417709SBP167BV
D6417709SBP167BVRenesasIC MCU 32BIT ROMLESS 240LFBGAMicrocontrollers240-LFBGA (13x13)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.75V ~ 2.05V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
240-LFBGA (13×13)
Package / Case:
240-LFBGA
720
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D6417709SF100B
D6417709SF100BRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.55V ~ 1.95V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
376
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