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Total Products: 18,739
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
R7F701407EABG-C#AC1N/AR7F701407EABG-C#AC1RenesasIC MCU 32BIT 512KB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
20
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R7F701407EABG-C#HC1N/AR7F701407EABG-C#HC1RenesasIC MCU 32BIT 512KB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,045
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R7F701408EABG-C#AC1N/AR7F701408EABG-C#AC1RenesasIC MCU 32BIT 3.75MB FLASH 376BGAMicrocontrollers376-BGA (23x23)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
159
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
376-BGA (23×23)
Package / Case:
376-BGA
404
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R7F701408EABG-C#BC1N/AR7F701408EABG-C#BC1RenesasIC MCU 32BIT 3.75MB FLASH 376BGAMicrocontrollers376-BGA (23x23)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
159
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
376-BGA (23×23)
Package / Case:
376-BGA
1,629
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QUOTE
R7F701408EABG-C#HC1N/AR7F701408EABG-C#HC1RenesasIC MCU 32BIT 3.75MB FLASH 376BGAMicrocontrollers376-BGA (23x23)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
159
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
376-BGA (23×23)
Package / Case:
376-BGA
347
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QUOTE
R7F701411EABG#AC1N/AR7F701411EABG#AC1RenesasIC MCU 32BIT 3.75MB FLASH 484BGAMicrocontrollers484-BGA (27x27)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
518
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QUOTE
R7F701411EABG#HC1N/AR7F701411EABG#HC1RenesasIC MCU 32BIT 3.75MB FLASH 484BGAMicrocontrollers484-BGA (27x27)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
743
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R7F701412EABG#AC1N/AR7F701412EABG#AC1RenesasIC MCU 32BIT 512KB FLASH 484BGAMicrocontrollers484-BGA (27x27)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
542
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QUOTE
R7F701412EABG#HC1N/AR7F701412EABG#HC1RenesasIC MCU 32BIT 3.75MB FLASH 484BGAMicrocontrollers484-BGA (27x27)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
1,256
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QUOTE
R7F701414EA03AFB-C#KA1N/AR7F701414EA03AFB-C#KA1RenesasIC MCU 32BIT LQFPMicrocontrollersN/AN/AN/A

N/A

1,035
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R7F701414EA03AFB#KA0N/AR7F701414EA03AFB#KA0RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

865
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R7F701414EA03AFB#YT0N/AR7F701414EA03AFB#YT0RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

1,156
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QUOTE
R7F701414EAFB-C#AA1N/AR7F701414EAFB-C#AA1RenesasIC MCU 32BIT LQFPMicrocontrollersN/AN/AN/A

N/A

1,557
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R7F701414EAFB-C#KA1N/AR7F701414EAFB-C#KA1RenesasIC MCU 32BIT LQFPMicrocontrollersN/AN/AN/A

N/A

522
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R7F701414EAFB#AA0N/AR7F701414EAFB#AA0RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

363
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R7F701414EAFB#KA0N/AR7F701414EAFB#KA0RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

11
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QUOTE
N/AN/AR7F701416EA35AFE#KA0RenesasICMicrocontrollersN/AN/AN/A

N/A

804
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QUOTE
N/AN/AR7F701416EAFD-C#BA0RenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

403
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QUOTE
N/AN/AR7F701420EAFE#KA0RenesasICMicrocontrollersN/AN/AN/A

N/A

965
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QUOTE
R7F701421EAFB-C#AA1N/AR7F701421EAFB-C#AA1RenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
103
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
938
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QUOTE

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