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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
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R7FA6M5BF3CFB#AA0
R7FA6M5BF3CFB#AA0RenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
628
N/A
R7FA6M5BF3CFB#BA0RenesasMCU RA6 ARM CM33 200MHZ 1M/512KMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD, SCI, SPI, QSPI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
404
R7FA6M5BF3CFC#AA0
R7FA6M5BF3CFC#AA0RenesasIC MCU 32BIT 1MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
584
N/A
R7FA6M5BF3CFC#BA0RenesasMCU RA6 ARM CM33 200MHZ 1M/512KMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD, SCI, SPI, QSPI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,543
R7FA6M5BF3CFP#AA0
R7FA6M5BF3CFP#AA0RenesasIC MCU 32BIT 1MB FLASH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
506
R7FA6M5BF3CFP#BA0
R7FA6M5BF3CFP#BA0RenesasMCU RA6 ARM CM33 200MHZ 1M/512KMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
950
R7FA6M5BG2CBG#AC0
R7FA6M5BG2CBG#AC0RenesasIC MCU 32BIT 1.5MB FLSH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
1,457
N/A
R7FA6M5BG2CBG#BC0RenesasMCU RA6 ARM CM33 200MHZ 1.5M/512Microcontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
900
R7FA6M5BG2CBM#BC0
R7FA6M5BG2CBM#BC0RenesasMCU RA6 ARM CM33 200MHZ 1.5M/512Microcontrollers144-LFBGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFBGA (7×7)
Package / Case:
144-LFBGA
771
N/A
R7FA6M5BG3CBM#BC0RenesasMCU RA6 ARM CM33 200MHZ 1.5M/512Microcontrollers144-LFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFBGA (7×7)
Package / Case:
144-LFBGA
1,165
R7FA6M5BG3CFB#AA0
R7FA6M5BG3CFB#AA0RenesasIC MCU 32BIT 1.5MB FLSH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
739
N/A
R7FA6M5BG3CFB#BA0RenesasMCU RA6 ARM CM33 200MHZ 1.5M/512Microcontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
740
R7FA6M5BG3CFC#AA0
R7FA6M5BG3CFC#AA0RenesasIC MCU 32BIT 1.5MB FLSH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
65
R7FA6M5BG3CFC#BA0
R7FA6M5BG3CFC#BA0RenesasMCU RA6 ARM CM33 200MHZ 1.5M/512Microcontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
701
R7FA6M5BG3CFP#AA0
R7FA6M5BG3CFP#AA0RenesasIC MCU 32BIT 1.5MB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
241
R7FA6M5BG3CFP#BA0
R7FA6M5BG3CFP#BA0RenesasMCU RA6 ARM CM33 200MHZ 1.5M/512Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
75
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,063
R7FA6M5BH2CBG#AC0
R7FA6M5BH2CBG#AC0RenesasIC MCU 32BIT 2MB FLASH 176LFBGAMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
802
N/A
R7FA6M5BH2CBG#BC0RenesasMCU RA6 ARM CM33 200MHZ 2M/512KMicrocontrollers176-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
132
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFBGA (13×13)
Package / Case:
176-LFBGA
774
R7FA6M5BH2CBM#BC0
R7FA6M5BH2CBM#BC0RenesasMCU:RAMicrocontrollers144-LFBGA (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Capacitive Touch, Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFBGA (7×7)
Package / Case:
144-LFBGA
695
N/A
R7FA6M5BH3CBM#BC0RenesasMCU RA6 ARM CM33 200MHZ 2M/512KMicrocontrollers144-LFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
Number of I/O:
109
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 25x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFBGA (7×7)
Package / Case:
144-LFBGA
956

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