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Total Products: 18,739
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/AN/AUPD70F3469M2GMA1-GAR-QS-AXRenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

854
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UPD70F3476AGJA-GAE-E2-GN/AUPD70F3476AGJA-GAE-E2-GRenesasIC MCU 32BIT 1.25MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
361
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UPD70F3478AGJA-GAE-G
UPD70F3478AGJA-GAE-GRenesas32BIT MCU V850E/SJ3-HMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
128
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,687
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UPD70F3482AGMA-GAR-G
UPD70F3482AGMA-GAR-GRenesas32BIT MCU V850E/SX3-HMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
156
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
27
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UPD70F3486AGMA-GAR-GN/AUPD70F3486AGMA-GAR-GRenesasIC MCU 32BIT 1.25MB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CSI, EBI/EMI, I2C, UART/USART, USB
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
156
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
92K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,053
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N/AN/AUPD70F3506GJA9-V05-GBG-X3-AXRenesasIC MCU 32BIT SMDMicrocontrollersN/AN/AN/A

N/A

506
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N/AN/AUPD70F3506GJA9-V05-GCK-X3-ATRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
1,250
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N/AN/AUPD70F3506GJA9-V06-GCK-X3-ATRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
645
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N/AN/AUPD70F3508GJA2-GBG-AXRenesasIC MCU 32BIT 1MB FLASH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22x10b
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
643
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N/AN/AUPD70F3508GJA2-GCK-ATRenesasIC MCU 32BIT SMDMicrocontrollersN/AN/AN/A

N/A

1,057
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N/AN/AUPD70F3508GJA9-GBG-AXRenesasIC MCU 32BIT SMDMicrocontrollersN/AN/AN/A

N/A

323
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N/AN/AUPD70F3508GJA9-V06-GCK-X3-ATRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
519
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N/AN/AUPD70F3508GJA9-V10-GCK-X3-ATRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
368
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N/AN/AUPD70F3509M2GJA2-GBG-AXRenesasIC MCU 32BIT FLASH SMDMicrocontrollersN/AN/AN/A

N/A

874
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N/AN/AUPD70F3509M2GJA2-GBG-QS-AXRenesas32BIT MCU V850E2/PX4-1M C144_202Microcontrollers144-HLFQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
73
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 22×10/12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
720
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UPD70F3522GJA-GAE-E3-GN/AUPD70F3522GJA-GAE-E3-GRenesas32BIT MCU V850E2/DX4 256K FLASHMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,294
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UPD70F3522GJA-GAE-G
UPD70F3522GJA-GAE-GRenesasIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,566
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UPD70F3522GJA9-GAE-Q-G
UPD70F3522GJA9-GAE-Q-GRenesasIC MCU 32BIT 256KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,005
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UPD70F3523GJA-GAE-GN/AUPD70F3523GJA-GAE-GRenesasIC MCU 32BIT 512KB FLSH 144LFQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
479
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UPD70F3523GJA-GAE-HN/AUPD70F3523GJA-GAE-HRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
195
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
830
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