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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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ADUCM363BCPZ128RL7
ADUCM363BCPZ128RL7Analog Devices Inc.IC MCU 32BIT 128KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
1,505
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ADUCM363BCPZ256
ADUCM363BCPZ256Analog Devices Inc.IC MCU 32BIT 256KB FLASH 48LFCSPMicrocontrollers48-LFCSP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
19
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x24b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFCSP (7×7)
Package / Case:
48-WFQFN Exposed Pad, CSP
622
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ADUCM4050BCBZ-R7
ADUCM4050BCBZ-R7Analog Devices Inc.IC MCU 32BIT 512KB FLASH 72WLCSPMicrocontrollers72-WLCSP (3.57x3.16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
72-WLCSP (3.57×3.16)
Package / Case:
72-UFBGA, WLCSP
1,194
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ADUCM4050BCBZ-RL
ADUCM4050BCBZ-RLAnalog Devices Inc.IC MCU 32BIT 512KB FLASH 72WLCSPMicrocontrollers72-WLCSP (3.57x3.16)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
72-WLCSP (3.57×3.16)
Package / Case:
72-UFBGA, WLCSP
1,346
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ADUCM4050BCPZ
ADUCM4050BCPZAnalog Devices Inc.IC MCU 32BIT 512KB FLASH 64LFCSPMicrocontrollers64-LFCSP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
216
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ADUCM4050BCPZ-R7
ADUCM4050BCPZ-R7Analog Devices Inc.IC MCU 32BIT 512KB FLASH 64LFCSPMicrocontrollers64-LFCSP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
404
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ADUCM4050BCPZ-RL
ADUCM4050BCPZ-RLAnalog Devices Inc.IC MCU 32BIT 512KB FLASH 64LFCSPMicrocontrollers64-LFCSP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
52MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
51
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.74V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFCSP (9×9)
Package / Case:
64-WFQFN Exposed Pad, CSP
1,562
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ADUCM410BBCZ
ADUCM410BBCZAnalog Devices Inc.IC MCU 32BIT 1MB FLASH 81CSPBGAMicrocontrollers81-CSPBGA (5x5)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x16b SAR; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
81-CSPBGA (5×5)
Package / Case:
81-VFBGA, CSPBGA
434
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ADUCM410BBCZ-RL7
ADUCM410BBCZ-RL7Analog Devices Inc.IC MCU 32BIT 1MB FLASH 81CSPBGAMicrocontrollers81-CSPBGA (5x5)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x16b SAR; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
81-CSPBGA (5×5)
Package / Case:
81-VFBGA, CSPBGA
1,513
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N/A
ADUCM410BCBZ-RL7Analog Devices Inc.IC MCU 32BIT 1MB FLASH 64WLCSPMicrocontrollers64-WLCSP (3.46x3.46)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
2.85V ~ 3.6V
Data Converters:
A/D 16x16b SAR; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
64-WLCSP (3.46×3.46)
Package / Case:
64-UFBGA, WLCSP
276
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N/A
ADUCM420BCBZ-RL7Analog Devices Inc.IC MCU 32BIT 512KB FLASH 64WLCSPMicrocontrollers64-WLCSP (3.46x3.46)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
28
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-WLCSP (3.46×3.46)
Package / Case:
64-UFBGA, WLCSP
1,261
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N/A
AFE4110B000YSTexas InstrumentsIC MCU 16BIT 16KB ROM WAFERSALEMicrocontrollersWafersaleN/A0°C ~ 70°C (TA)
Core Processor:
MSP430
Core Size:
16-Bit
Speed:
8MHz
Peripherals:
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 1.55V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Wafersale
Package / Case:
Die
349
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AM188EM-20VC/W
AM188EM-20VC/WAdvanced Micro DevicesIC MCU 16BIT ROMLESS 100TQFPMicrocontrollers100-TQFP (14x14)N/A0°C ~ 100°C (TC)
Core Processor:
80C188
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
Serial Port, SPI
Peripherals:
DMA, WDT
Number of I/O:
32
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-LQFP
510
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AM2431BSDFHIALVR
AM2431BSDFHIALVRTexas InstrumentsIC MCU 32BIT 128KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
503
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AM2431BSDFHIALXR
AM2431BSDFHIALXRTexas InstrumentsIC MCU 32BIT 128KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
148
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
955
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AM2431BSDGHIALVR
AM2431BSDGHIALVRTexas InstrumentsIC MCU 32BIT 128KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
198
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
413
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AM2431BSDGHIALXR
AM2431BSDGHIALXRTexas InstrumentsIC MCU 32BIT 128KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, WDT
Number of I/O:
148
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
1,468
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AM2432BKEGHIALXR
AM2432BKEGHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
1,531
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AM2432BKFGHIALXR
AM2432BKFGHIALXRTexas InstrumentsIC MCU 32BIT 256KB TCM 293VFBGAMicrocontrollers293-FC/CSP (11x11)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
148
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
293-FC/CSP (11×11)
Package / Case:
293-VFBGA, FCCSPBGA
1,845
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AM2432BSDFHIALVR
AM2432BSDFHIALVRTexas InstrumentsIC MCU 32BIT 256KB TCM 441FCBGAMicrocontrollers441-FCBGA (17.2x17.2)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-M4F, ARM® Cortex®-R5F
Core Size:
32-Bit Tri-Core
Speed:
400MHz, 800MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
198
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
441-FCBGA (17.2×17.2)
Package / Case:
441-BFBGA, FCBGA
512
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