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Total Products: 76,307
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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R7F701431EABG#HC1
R7F701431EABG#HC1Renesas32BIT MCU RH850/D1M2 PBGA484Microcontrollers484-BGA (27x27)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
143
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R7F701432EABG#BC1
R7F701432EABG#BC1RenesasIC MCU 32BIT 5MB FLASH 484BBGAMicrocontrollers484-BGA (27x27)N/A-40°C ~ 150°C
Core Processor:
RH850
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SPI
Peripherals:
POR, PWM
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
3.616K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
756
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R7F701432EABG#HC1
R7F701432EABG#HC1Renesas32BIT MCU RH850/D1M2H 5MB PBGA48Microcontrollers484-BGA (27x27)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
1,292
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N/AN/AR7F701436EAFD-C#KA0RenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

905
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N/AN/AR7F701436EAFE-C#KA0RenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

879
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N/AN/AR7F701436EAFE#AA0RenesasICMicrocontrollersN/AN/AN/A

N/A

6
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N/AN/AR7F701436EAFE#KA0RenesasICMicrocontrollersN/AN/AN/A

N/A

1,016
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N/A
R7F701437EAFD-C#KA0RenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollersN/AN/AN/A

N/A

254
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N/A
R7F701437EAFE-C#BA0Renesas32BIT MCU RH850/D1S1 1MB 144LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LCD, PWM, Temp Sensor, WDT
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
459
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N/AN/AR7F701442EAFB-C#AA0RenesasIC MCU 32BIT 4MB FLASH LQFPMicrocontrollers-N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
1,653
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N/AN/AR7F701442EAFB-C#BA0RenesasIC MCU 32BIT 4MB FLASH LQFPMicrocontrollers-N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
822
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N/AN/AR7F701442EAFB-C#KA0RenesasIC MCU 32BIT 4MB FLASH LQFPMicrocontrollers-N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
791
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R7F701461EABG-C#BC0
R7F701461EABG-C#BC0RenesasIC MCU 32BIT 4MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, POR, PWM, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
2.9M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,043
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R7F701461EABG-C#HC0
R7F701461EABG-C#HC0RenesasIC MCU 32BITMicrocontrollersN/AN/AN/A

N/A

264
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R7F701462EAFB-C#BA0
R7F701462EAFB-C#BA0RenesasIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, POR, PWM, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
2.07M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
411
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R7F701462EAFB-C#KA0
R7F701462EAFB-C#KA0RenesasIC MCU 32BIT 4MB FLASH 176LQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, POR, PWM, Temp Sensor, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
2.07M x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,022
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N/AN/AR7F7015264AFP#BA2RenesasIC MCU 32BIT LFQFPMicrocontrollersN/AN/AN/A

N/A

743
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N/AN/AR7F7015273AFP-C#KA2RenesasIC MCU 32BIT LQFPMicrocontrollersN/AN/AN/A

N/A

1,289
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N/AN/AR7F7015303AFP-C#AA2RenesasIC MCU 32BIT LQFPMicrocontrollersN/AN/AN/A

N/A

1,921
GET A
QUOTE
N/AN/AR7F7015453AFP#AA1RenesasIC MCU 32BIT SMDMicrocontrollersN/AN/AN/A

N/A

918
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