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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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R7F701402EAFE-C#BA1N/AR7F701402EAFE-C#BA1RenesasIC MCU 32BIT 4MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
103
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
231
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R7F701402EAFE-C#KA1N/AR7F701402EAFE-C#KA1RenesasIC MCU 32BIT 4MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
103
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,009
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R7F701403EAFB-C#AA1N/AR7F701403EAFB-C#AA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,255
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R7F701403EAFB-C#KA1N/AR7F701403EAFB-C#KA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
364
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R7F701403EAFB#AA0N/AR7F701403EAFB#AA0RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,933
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R7F701403EAFB#KA0N/AR7F701403EAFB#KA0RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
1,067
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R7F701403EAFB#YR3N/AR7F701403EAFB#YR3RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
881
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R7F701403EAFD-C#KA1N/AR7F701403EAFD-C#KA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
881
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R7F701403EAFE-C#KA1N/AR7F701403EAFE-C#KA1RenesasIC MCU 32BIT 4MB FLASH 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 150°C (TA)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
429
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R7F701406EABG-C#AC1N/AR7F701406EABG-C#AC1RenesasIC MCU 32BIT 3.75MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,782
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R7F701406EABG-C#BC1N/AR7F701406EABG-C#BC1RenesasIC MCU 32BIT 3.75MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,730
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R7F701406EABG-C#HC1N/AR7F701406EABG-C#HC1RenesasIC MCU 32BIT 3.75MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
646
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QUOTE
R7F701406EABG#KC0N/AR7F701406EABG#KC0RenesasIC MICROCONTROLLERMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
395
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QUOTE
R7F701407EA17ABG-C#HC1N/AR7F701407EA17ABG-C#HC1RenesasIC SYNERGY MCU 32BIT BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
520
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QUOTE
R7F701407EABG-C#AC1N/AR7F701407EABG-C#AC1RenesasIC MCU 32BIT 512KB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
698
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QUOTE
R7F701407EABG-C#HC1N/AR7F701407EABG-C#HC1RenesasIC MCU 32BIT 512KB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
126
Program Memory Size:
5MB (5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
410
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R7F701408EABG-C#AC1N/AR7F701408EABG-C#AC1RenesasIC MCU 32BIT 3.75MB FLASH 376BGAMicrocontrollers376-BGA (23x23)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
159
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
376-BGA (23×23)
Package / Case:
376-BGA
780
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QUOTE
R7F701408EABG-C#BC1N/AR7F701408EABG-C#BC1RenesasIC MCU 32BIT 3.75MB FLASH 376BGAMicrocontrollers376-BGA (23x23)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
159
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
376-BGA (23×23)
Package / Case:
376-BGA
83
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QUOTE
R7F701408EABG-C#HC1N/AR7F701408EABG-C#HC1RenesasIC MCU 32BIT 3.75MB FLASH 376BGAMicrocontrollers376-BGA (23x23)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
159
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
376-BGA (23×23)
Package / Case:
376-BGA
399
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QUOTE
R7F701411EABG#AC1N/AR7F701411EABG#AC1RenesasIC MCU 32BIT 3.75MB FLASH 484BGAMicrocontrollers484-BGA (27x27)N/A-40°C ~ 150°C (TJ)
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
199
Program Memory Size:
3.75MB (3.75M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
484-BGA (27×27)
Package / Case:
484-BBGA
595
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QUOTE

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