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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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SPC5746CBK1ACMH6N/ASPC5746CBK1ACMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 200MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
65
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
1,289
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SPC5746CBK1AMKU6
SPC5746CBK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
850
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SPC5746CBK1AMMH6N/ASPC5746CBK1AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
911
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SPC5746CBK1AMMJ6
SPC5746CBK1AMMJ6NXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
183
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SPC5746CBK1AVKU6
SPC5746CBK1AVKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
487
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N/AN/ASPC5746CFK1ACKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 200MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
235
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SPC5746CFK1ACMH6N/ASPC5746CFK1ACMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 200MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
65
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 36x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
1,266
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N/AN/ASPC5746CFK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals:
DMA, I2S, LVD/HVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 68x10b, 31x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
649
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SPC5746CHK0AMKU6
SPC5746CHK0AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,134
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SPC5746CHK0AMMH6
SPC5746CHK0AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
638
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SPC5746CHK0AMMJ6
SPC5746CHK0AMMJ6NXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
573
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N/AN/ASPC5746CHK1ACKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals:
DMA, I2S, LVD/HVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 68x10b, 31x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
160
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SPC5746CHK1ACMJ6
SPC5746CHK1ACMJ6NXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
386
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SPC5746CHK1AMKU6
SPC5746CHK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
404
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SPC5746CHK1AMMH6
SPC5746CHK1AMMH6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz, 160MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals:
DMA, I2S, LVD/HVD, POR, WDT
Number of I/O:
65
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 68x10b, 31x12b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LBGA
1,993
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SPC5746CHK1AMMJ6
SPC5746CHK1AMMJ6NXP SemiconductorsIC MCU 32BIT 3MB FLSH 256MAPPBGAMicrocontrollers256-MAPPBGA (17x17)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
178
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPPBGA (17×17)
Package / Case:
256-LBGA
945
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SPC5746CHK1AVKU6
SPC5746CHK1AVKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,056
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SPC5746CK1AMKU2
SPC5746CK1AMKU2NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,032
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SPC5746CK1AMKU2R
SPC5746CK1AMKU2RNXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
582
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QUOTE
SPC5746CK1AMKU6
SPC5746CK1AMKU6NXP SemiconductorsIC MCU 32BIT 3MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z2, e200z4
Core Size:
32-Bit Dual-Core
Speed:
80MHz/160MHz
Connectivity:
CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals:
DMA, LVD, POR, WDT
Number of I/O:
129
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 80x10b, 64x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,306
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