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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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UPD70F3370M2GBA-GAH-AX
UPD70F3370M2GBA-GAH-AXRenesasIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,663
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UPD70F3371M2GBA-GAH-AX
UPD70F3371M2GBA-GAH-AXRenesas32BIT MCU V850ES/FE3 128KBMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,490
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UPD70F3371M2GBA-GAH-E2-AXN/AUPD70F3371M2GBA-GAH-E2-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,355
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UPD70F3371M2GBA-GAH-E3-QS-AX
UPD70F3371M2GBA-GAH-E3-QS-AXRenesas32BIT MCU V850ES/FE3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
14
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UPD70F3371M2GBA-GAH-QS-AXN/AUPD70F3371M2GBA-GAH-QS-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
282
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UPD70F3371M2GBA1-GAH-AX
UPD70F3371M2GBA1-GAH-AXRenesas32BIT MCU V850ES/FE3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
334
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UPD70F3371M2GBA1-GAH-E2-AX
UPD70F3371M2GBA1-GAH-E2-AXRenesas32BIT MCU V850ES/FE3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,304
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UPD70F3371M2GBA1-GAH-E3-QS-AXN/AUPD70F3371M2GBA1-GAH-E3-QS-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
970
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UPD70F3371M2GBA2-GAH-AX
UPD70F3371M2GBA2-GAH-AXRenesas32BIT MCU V850ES/FE3Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 10x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
115
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UPD70F3372M1GKA-GAK-AX
UPD70F3372M1GKA-GAK-AXRenesasIC MCU 32BIT 128KB FLASH 80LFQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,686
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N/A
UPD70F3373M2GKA-GAK-AXRenesas32BIT MCU V850ES/FF3 256KMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,905
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N/AN/AUPD70F3373M2GKA-GAK-E1-AXRenesasIC MCU 32BIT 256KB FLASH 80LQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
404
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N/A
UPD70F3373M2GKA-GAK-E2-AXRenesasMICRO 32BIT MID-RANGE FLASH V850Microcontrollers80-LFQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,227
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N/AN/AUPD70F3373M2GKA-GAK-E2-QS-AXRenesasIC MCU 32BITMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
67
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
376
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QUOTE
N/A
UPD70F3374M2GCA-UEU-AXRenesas32BIT MCU V850ES/FG3 128KMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 16x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,110
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UPD70F3374M2GCA2-UEU-AXN/AUPD70F3374M2GCA2-UEU-AXRenesasIC MCU 32BIT 128MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
24MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 16x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,369
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QUOTE
N/A
UPD70F3375M2GCA-UEU-AXRenesas32BIT MCU V850ES/FG3 256K QFP100Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 16x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,276
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QUOTE
UPD70F3375M2GCA1-UEU-E2-AXN/AUPD70F3375M2GCA1-UEU-E2-AXRenesasIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
66
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QUOTE
UPD70F3375M2GCA1-UEU-QS-AXN/AUPD70F3375M2GCA1-UEU-QS-AXRenesasIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 16x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
145
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QUOTE
N/A
UPD70F3376AM2GCA-UEU-AXRenesas32BIT MCU V850ES/FG3Microcontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
84
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 16x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,024
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QUOTE

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