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Total Products: 76,307
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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UPD70F3379ZM2GJA-GAE-AXN/AUPD70F3379ZM2GJA-GAE-AXRenesasIC MCU 32BIT SMDMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,729
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UPD70F3380M2GJA-GAE-AX
UPD70F3380M2GJA-GAE-AXRenesasMICRO 32BIT MID-RANGE FLASH V850Microcontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,391
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UPD70F3380M2GJA1-GAE-AX
UPD70F3380M2GJA1-GAE-AXRenesasMICRO 32BIT MID-RANGE FLASH V850Microcontrollers144-LQFP (20x20)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,979
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UPD70F3380M2GJA2-GAE-AX
UPD70F3380M2GJA2-GAE-AXRenesasMICRO 32BIT MID-RANGE FLASH V850Microcontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
127
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UPD70F3380ZM2GJA-GAE-AX
UPD70F3380ZM2GJA-GAE-AXRenesas32BIT MCU V850ES/FJ3 512KMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
78
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UPD70F3382M2GJA-GAE-AX
UPD70F3382M2GJA-GAE-AXRenesasIC MCU 32BIT 1MB FLASH 144LFQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,100
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UPD70F3382M2GJA1-GAE-AX
UPD70F3382M2GJA1-GAE-AXRenesas32BIT MCU V850ES/FX3Microcontrollers144-LQFP (20x20)N/A-40°C ~ 110°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
463
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UPD70F3382M2GJA2-GAE-AXN/AUPD70F3382M2GJA2-GAE-AXRenesasIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,164
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UPD70F3385M2GMA-GAR-AX
UPD70F3385M2GMA-GAR-AXRenesas32BIT MCU V850ES/FK3Microcontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 40x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
413
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UPD70F3385M2GMA2-GAR-AX
UPD70F3385M2GMA2-GAR-AXRenesasV850ES/FK3Microcontrollers176-LFQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
V850ES
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
60K x 8
Voltage – Supply (Vcc/Vdd):
3.3V ~ 5.5V
Data Converters:
A/D 40x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
684
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UPD70F3416GC(A)-UEU-AXN/AUPD70F3416GC(A)-UEU-AXRenesasIC MCU 32BIT 128MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
24MHz
Connectivity:
CANbus, CSIB, I2C, LIN, SPI, UART/USART
Peripherals:
LCD, WDT
Number of I/O:
72
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,362
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N/A
UPD70F3417GC(A)-UEU-AXRenesasMOSFET N-CHMicrocontrollersN/AN/AN/A

N/A

889
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N/A
UPD70F3417GC(A)-UEU-QS-AXRenesasMOSFET N-CHMicrocontrollersN/AN/AN/A

N/A

157
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N/AN/AUPD70F3421GJ(A)-GAE-E2-QS-AXRenesasIC MCU 32BITMicrocontrollersN/AN/AN/A

N/A

801
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UPD70F3422GJ(A)-GAE-AXN/AUPD70F3422GJ(A)-GAE-AXRenesasIC MCU 32BIT 384KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, UART/USART
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
756
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QUOTE
UPD70F3422GJ(A)-GAE-E2-AXN/AUPD70F3422GJ(A)-GAE-E2-AXRenesasIC MCU 32BIT 384KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, UART/USART
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,013
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N/AN/AUPD70F3423GJ(A)-GAE-E2-QS-AXRenesasIC MCU 32BITMicrocontrollersN/AN/AN/A

N/A

487
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N/AN/AUPD70F3423GJ(A)-GAE-E3-QS-AXRenesasIC MCU 32BITMicrocontrollersN/AN/AN/A

N/A

689
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UPD70F3423GJA-033-GAE-Q-GN/AUPD70F3423GJA-033-GAE-Q-GRenesasIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E1
Core Size:
32-Bit
Speed:
32MHz
Connectivity:
CANbus, CSI, I2C, UART/USART
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
727
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N/A
UPD70F3424GJ(A)-GAE-AXRenesasIC MCU 32BITMicrocontrollersN/AN/AN/A

N/A

260
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