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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/AN/AUPD70F3564GD-FAD-AXRenesasIC MCU 32BIT FLASH SMDMicrocontrollersN/AN/AN/A

N/A

1,578
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N/AN/AUPD70F3564GDA-FAD-AXRenesasIC MCU 32BIT 2MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, Ethernet, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
161
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 48x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,842
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N/AN/AUPD70F3564GDA1-FAD-AXRenesasIC MCU 32BIT 2MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, Ethernet, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
161
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 48x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,615
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UPD70F3570GBA-GAH-E3-AXN/AUPD70F3570GBA-GAH-E3-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
698
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UPD70F3570GBA-GAH-E3-QS-AXN/AUPD70F3570GBA-GAH-E3-QS-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
860
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UPD70F3570GBA2-GAH-AX
UPD70F3570GBA2-GAH-AXRenesas32-BIT MCU V850E2/FX4-L A064_101Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
301
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UPD70F3570GBA2-GAH-E3-AX
UPD70F3570GBA2-GAH-E3-AXRenesas32BIT MCU V850E2/FX4-L A064_1010Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,140
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UPD70F3571GBA-GAH-AX
UPD70F3571GBA-GAH-AXRenesas32-BIT MCU V850E2/FX4-L A064_101Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
28K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,004
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UPD70F3572GBA-GAH-AXN/AUPD70F3572GBA-GAH-AXRenesasIC MCU 32BIT 512KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
561
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UPD70F3572GBA1-GAH-AX
UPD70F3572GBA1-GAH-AXRenesas32BIT MCU V850E2/FX4-LMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
699
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UPD70F3572GBA2-GAH-E2-QS-AX
UPD70F3572GBA2-GAH-E2-QS-AXRenesas32-BIT MCU V850E2/FX4-L A064_101Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
707
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UPD70F3572GBA2-GAH-QS-AXN/AUPD70F3572GBA2-GAH-QS-AXRenesasIC MCU 32BIT 512KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
872
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N/AN/AUPD70F3573GKA2-GAK-AXRenesasIC MCU 32BIT 256KB FLASH 80LQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
422
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QUOTE
N/A
UPD70F3573GKA2-GAK-E2-AXRenesas32BIT MCU V850E2/FX4-L 256K 24KMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
425
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N/AN/AUPD70F3574GKA-GAK-AXRenesasIC MCU 32BIT 384KB FLASH 80LQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
28K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,580
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N/AN/AUPD70F3574GKA2-GAK-AXRenesasIC MCU 32BIT 384KB FLASH 80LQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
28K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,136
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N/AN/AUPD70F3575GKA-GAK-AXRenesasIC MCU 32BIT 512KB FLASH 80LQFPMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
1,713
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QUOTE
N/A
UPD70F3575GKA2-GAK-AXRenesasV850E2/FX4-L 512K LFQFP-80 -40 TMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
617
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QUOTE
N/A
UPD70F3575GKA2-GAK-E2-AXRenesas32BIT MCU V850E2/FX4-LMicrocontrollers80-LFQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
61
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 14x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LFQFP (12×12)
Package / Case:
80-LQFP
390
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UPD70F3576GC-UEU-AX
UPD70F3576GC-UEU-AXRenesasIC MCU 32BIT 256KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
76
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
998
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