| N/A | | F59L8G81KSA-25TIG2R | ESMT | 8Gb NAND Flash Ind. | Flash Memory | TSOPI-48 | 2.7V ~ 3.6V | -40°C – 85°C | Write Cycle Time Word Page: 200 µs Technology: NAND Flash - SLC Memory Organization: 512M x 8 x 2 die Memory Interface: Parallel | 1,264 | |
| N/A | | F59L8G81XA-25BG2Y | ESMT | 8Gb NAND Flash | Flash Memory | BGA-63 | 2.7V ~ 3.6V | 0°C – 70°C | Write Cycle Time Word Page: 200 µs Technology: NAND Flash - SLC Memory Organization: 1G x 8 Memory Interface: Parallel | 479 | |
| N/A | | F59L8G81XA-25BIG2Y | ESMT | 8Gb NAND Flash Ind. | Flash Memory | BGA-63 | 2.7V ~ 3.6V | -40°C – 85°C | Write Cycle Time Word Page: 200 µs Technology: NAND Flash - SLC Memory Organization: 1G x 8 Memory Interface: Parallel | 1,023 | |
| N/A | | F59L8G81XA-25TG2Y | ESMT | 8Gb NAND Flash | Flash Memory | TSOPI-48 | 2.7V ~ 3.6V | 0°C – 70°C | Write Cycle Time Word Page: 200 µs Technology: NAND Flash - SLC Memory Organization: 1G x 8 Memory Interface: Parallel | 1,798 | |
| N/A | | F59L8G81XA-25TIG2Y | ESMT | 8Gb NAND Flash Ind. | Flash Memory | TSOPI-48 | 2.7V ~ 3.6V | -40°C – 85°C | Write Cycle Time Word Page: 200 µs Technology: NAND Flash - SLC Memory Organization: 1G x 8 Memory Interface: Parallel | 93 | |
| N/A | | FC51E08SQP1A (2A) | ESMT | 64Gb Memory Ind. | eMMC Memory | 153 ball BGA | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: N/A Memory Organization: 8G x 8 Memory Interface: eMMC 5.1 | 135 | |
| N/A | | FC51J32SJTS2A (2D) | ESMT | 256Gb Memory Ind. | eMMC Memory | 153 ball BGA | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: N/A Memory Organization: 32G x 8 Memory Interface: eMMC 5.1 | 293 | |
| N/A | | FC51J32SJTS2A-2.5BWGE2D | ESMT | eMMC Flash 3.3V 32 GByte - eMMC Flash Memory | eMMC Memory | 153-ball BGA | 2.7 V to 3.6 V | -25°C to +85°C | JEDEC Standard: eMMC Electrical Standard 5.1 LBA (Hex/ Dec): 0x039EC000 / 60,735,488 Bus Width: 1-bit (default), 4-bit, 8-bit Max Clock Speed Ordering: 200 MHz (Ordering table); HS200/HS400 timing tables included Sequential Read (HS400, 8-Bit): 250 MB/s Sequential Write (HS400, 8-Bit): 210 MB/s Memory Size: 32 GB (31,096,569,856 bytes) Memory Type: eMMC Flash Memory Operating Temperature: -25°C to +85°C I/O Supply (VCCQ): 1.70 – 1.95 V or 2.7 – 3.6 V Storage Temperature: -40°C to +85°C Boot Partition 1: 4096 KB Boot Partition 2: 4096 KB Large Sector Size Support: Not supported (4 KB) Package Dimensions: 11.5 mm x 13.0 mm body; max height 1.0 mm Ball Pitch: 0.50 mm (BSC) Pb Free: Yes (per ordering info) | 1,797 | |
| N/A | | FC51J32SJTS2A-2.5BWGI2D | ESMT | eMMC Flash 3.3V 32 GByte - eMMC Flash Memory | eMMC Memory | 153-ball BGA | 2.7 V to 3.6 V | -40°C to +85°C | JEDEC Standard: eMMC Electrical Standard 5.1 LBA (Hex/ Dec): 0x039EC000 / 60,735,488 Bus Width: 1-bit (default), 4-bit, 8-bit Max Clock Speed Ordering: 200 MHz (Ordering table); HS200/HS400 timing tables included Sequential Read (HS400, 8-Bit): 250 MB/s Sequential Write (HS400, 8-Bit): 210 MB/s Memory Size: 32 GB (31,096,569,856 bytes) Memory Type: eMMC Flash Memory Operating Temperature: -40°C to +85°C I/O Supply (VCCQ): 1.70 – 1.95 V or 2.7 – 3.6 V Storage Temperature: -40°C to +85°C Large Sector Size Support: Not supported (4 KB) Package Dimensions: 11.5 mm x 13.0 mm body; max height 1.0 mm Pb Free: Yes (per ordering info) | 296 | |
| N/A | N/A | FM62D1G1GMB (2G) | ESMT | 1Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 1,743 | |
| N/A | N/A | FM62D2G1GXA (2U) | ESMT | 2Gb NAND+LPDDR2 MCP | MCP Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 856 | |
| N/A | N/A | FM62D2G2GKA (2Q) | ESMT | 2Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 873 | |
| N/A | N/A | FM62D2G2GXA (2L) | ESMT | 2Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 514 | |
| N/A | N/A | FM62D4G2GXB (2V) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 902 | |
| N/A | N/A | FM6BD1G12MB(2W) | ESMT | 1Gb NAND+LPDDR2 MCP Ind. | MCP Memory | 10.5x8 (mm),162ball | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 32M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 443 | |
| N/A | N/A | FM6BD1G1GMB (2G) | ESMT | 1Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 32M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 966 | |
| N/A | N/A | FM6BD2G2GKA (2Q) | ESMT | 2Gb NAND+LPDDR2 MCP | MCP Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 1,850 | |
| N/A | N/A | FM6BD2G2GXA(2L) | ESMT | 2Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 1,850 | |
| N/A | N/A | FM6BD2G2GXA2L | ESMT | 2Gb NAND+LPDDR2 MCP Ind. | Flash Memory | 10.5x8 (mm),162ball | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 95 | |
| N/A | N/A | FM6BD4G2GKA (2J) | ESMT | 4Gb NAND+LPDDR2 MCP | MCP Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 1,230 | |