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Total Products: 31,199
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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DSPIC33EP256MC506T-E/MR
DSPIC33EP256MC506T-E/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
775
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DSPIC33EP256MC506T-E/PT
DSPIC33EP256MC506T-E/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
487
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DSPIC33EP256MC506T-I/MR
DSPIC33EP256MC506T-I/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
815
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DSPIC33EP256MC506T-I/PT
DSPIC33EP256MC506T-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
16K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
329
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DSPIC33EP256MU806-E/MR
DSPIC33EP256MU806-E/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,710
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DSPIC33EP256MU806-E/PT
DSPIC33EP256MU806-E/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
991
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DSPIC33EP256MU806-I/MR
DSPIC33EP256MU806-I/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,306
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DSPIC33EP256MU806-I/PT
DSPIC33EP256MU806-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
1,424
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DSPIC33EP256MU806T-I/MR
DSPIC33EP256MU806T-I/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
426
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DSPIC33EP256MU806T-I/PT
DSPIC33EP256MU806T-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
516
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DSPIC33EP256MU810-E/BG
DSPIC33EP256MU810-E/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
1,770
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DSPIC33EP256MU810-E/PF
DSPIC33EP256MU810-E/PFMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
189
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DSPIC33EP256MU810-E/PT
DSPIC33EP256MU810-E/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
35
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DSPIC33EP256MU810-I/BG
DSPIC33EP256MU810-I/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
219
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DSPIC33EP256MU810-I/PF
DSPIC33EP256MU810-I/PFMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
341
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DSPIC33EP256MU810-I/PT
DSPIC33EP256MU810-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
859
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DSPIC33EP256MU810T-E/BG
DSPIC33EP256MU810T-E/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
1,666
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DSPIC33EP256MU810T-E/PF
DSPIC33EP256MU810T-E/PFMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
402
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DSPIC33EP256MU810T-E/PT
DSPIC33EP256MU810T-E/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
657
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DSPIC33EP256MU810T-I/BG
DSPIC33EP256MU810T-I/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
12K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 32x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
745
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