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Total Products: 31,198
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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DSPIC33EP64GP504T-I/MV
DSPIC33EP64GP504T-I/MVMicrochip TechnologyIC MCU 16BIT 64KB FLASH 48UQFNMicrocontrollers48-UQFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-UQFN (6×6)
Package / Case:
48-UFQFN Exposed Pad
1,820
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DSPIC33EP64GP504T-I/PT
DSPIC33EP64GP504T-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
1,689
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DSPIC33EP64GP504T-I/TL
DSPIC33EP64GP504T-I/TLMicrochip TechnologyIC MCU 16BIT 64KB FLASH 44VTLAMicrocontrollers44-VTLA (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 9x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-VTLA (6×6)
Package / Case:
44-VFTLA Exposed Pad
455
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DSPIC33EP64GP506-E/MR
DSPIC33EP64GP506-E/MRMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
915
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DSPIC33EP64GP506-E/PT
DSPIC33EP64GP506-E/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
969
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DSPIC33EP64GP506-I/MR
DSPIC33EP64GP506-I/MRMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
835
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DSPIC33EP64GP506-I/PT
DSPIC33EP64GP506-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
15
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DSPIC33EP64GP506T-E/MR
DSPIC33EP64GP506T-E/MRMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,473
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DSPIC33EP64GP506T-E/PT
DSPIC33EP64GP506T-E/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
1,437
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DSPIC33EP64GP506T-I/MR
DSPIC33EP64GP506T-I/MRMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
799
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DSPIC33EP64GP506T-I/PT
DSPIC33EP64GP506T-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
446
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DSPIC33EP64GS502-E/2N
DSPIC33EP64GS502-E/2NMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28UQFNMicrocontrollers28-UQFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (6×6)
Package / Case:
28-UQFN Exposed Pad
250
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DSPIC33EP64GS502-E/MM
DSPIC33EP64GS502-E/MMMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
653
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DSPIC33EP64GS502-E/SO
DSPIC33EP64GS502-E/SOMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,431
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DSPIC33EP64GS502-I/2N
DSPIC33EP64GS502-I/2NMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28UQFNMicrocontrollers28-UQFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (6×6)
Package / Case:
28-UQFN Exposed Pad
1,776
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DSPIC33EP64GS502-I/MM
DSPIC33EP64GS502-I/MMMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
1,229
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DSPIC33EP64GS502-I/MX
DSPIC33EP64GS502-I/MXMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28UQFNMicrocontrollers28-UQFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (6×6)
Package / Case:
28-UQFN Exposed Pad
1,342
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DSPIC33EP64GS502-I/SO
DSPIC33EP64GS502-I/SOMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
985
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DSPIC33EP64GS502T-E/2N
DSPIC33EP64GS502T-E/2NMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28UQFNMicrocontrollers28-UQFN (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-UQFN (6×6)
Package / Case:
28-UQFN Exposed Pad
514
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DSPIC33EP64GS502T-E/MM
DSPIC33EP64GS502T-E/MMMicrochip TechnologyIC MCU 16BIT 64KB FLASH 28QFNMicrocontrollers28-QFN-S (6x6)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN-S (6×6)
Package / Case:
28-VQFN Exposed Pad
1,690
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