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Total Products: 31,198
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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DSPIC33EV64GM104T-I/ML
DSPIC33EV64GM104T-I/MLMicrochip TechnologyIC MCU 16BIT 64KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
1,694
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DSPIC33EV64GM104T-I/P8
DSPIC33EV64GM104T-I/P8Microchip TechnologyIC MCU 16BIT 64KB FLASH 48TQFPMicrocontrollers48-TQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70MHz
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 24×10/12b; D/A 1x7b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-TQFP (7×7)
Package / Case:
48-TQFP
259
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DSPIC33EV64GM104T-I/PT
DSPIC33EV64GM104T-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 24×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
826
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DSPIC33EV64GM106-E/MR
DSPIC33EV64GM106-E/MRMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 36×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,293
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DSPIC33EV64GM106-E/PT
DSPIC33EV64GM106-E/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 36×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
165
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DSPIC33EV64GM106-I/MR
DSPIC33EV64GM106-I/MRMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 36×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
489
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DSPIC33EV64GM106-I/PT
DSPIC33EV64GM106-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 36×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
809
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DSPIC33EV64GM106T-I/MR
DSPIC33EV64GM106T-I/MRMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 36×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
293
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DSPIC33EV64GM106T-I/PT
DSPIC33EV64GM106T-I/PTMicrochip TechnologyIC MCU 16BIT 64KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
64KB (22K x 24)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 36×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
511
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DSPIC33FJ06GS001-E/P
DSPIC33FJ06GS001-E/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
1,163
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DSPIC33FJ06GS001-E/SO
DSPIC33FJ06GS001-E/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
1,660
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DSPIC33FJ06GS001-E/SS
DSPIC33FJ06GS001-E/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
1,141
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DSPIC33FJ06GS001-I/P
DSPIC33FJ06GS001-I/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
1,582
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DSPIC33FJ06GS001-I/SO
DSPIC33FJ06GS001-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
364
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DSPIC33FJ06GS001-I/SS
DSPIC33FJ06GS001-I/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
14
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DSPIC33FJ06GS001T-I/SO
DSPIC33FJ06GS001T-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
375
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DSPIC33FJ06GS001T-I/SS
DSPIC33FJ06GS001T-I/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
618
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DSPIC33FJ06GS101-E/P
DSPIC33FJ06GS101-E/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
739
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DSPIC33FJ06GS101-E/SO
DSPIC33FJ06GS101-E/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
1,734
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DSPIC33FJ06GS101-I/P
DSPIC33FJ06GS101-I/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
447
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