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Total Products: 220,361
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
TMS320F28375SZWTSTMS320F28375SZWTSTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,076
TMS320F28375SZWTTTMS320F28375SZWTTTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
82K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
376
TMS320F28376DPTPSTMS320F28376DPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
278
TMS320F28376DPTPTTMS320F28376DPTPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,451
TMS320F28376DZWTSTMS320F28376DZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
476
TMS320F28376DZWTTTMS320F28376DZWTTTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
86K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
509
TMS320F28376SPTPSTMS320F28376SPTPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 20x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
957
TMS320F28376SPTPTTMS320F28376SPTPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 20x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
248
TMS320F28376SPZPSTMS320F28376SPZPSTexas InstrumentsIC MCU 32BIT 512KB FLSH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 14x12b, 14x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,811
TMS320F28376SPZPTTMS320F28376SPZPTTexas InstrumentsIC MCU 32BIT 512KB FLSH 100HTQFPMicrocontrollers100-HTQFP (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 20x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HTQFP (14×14)
Package / Case:
100-TQFP Exposed Pad
1,000
TMS320F28376SZWTSTMS320F28376SZWTSTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
993
TMS320F28376SZWTTTMS320F28376SZWTTTexas InstrumentsIC MCU 32BIT 512KB FLSH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
512KB (256K x 16)
Program Memory Type:
FLASH
RAM Size:
66K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
302
TMS320F28377DGWTEPTMS320F28377DGWTEPTexas InstrumentsNPI SOPRANO IHR4 RTM 12/31Microcontrollers337-NFBGA (16x16)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,600
TMS320F28377DPTPEPTMS320F28377DPTPEPTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-55°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
696
TMS320F28377DPTPQTMS320F28377DPTPQTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
152
TMS320F28377DPTPSTMS320F28377DPTPSTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,721
TMS320F28377DPTPTTMS320F28377DPTPTTexas InstrumentsIC MCU 32BIT 1MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
97
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 20x12b, 9x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
94
TMS320F28377DZWTQTMS320F28377DZWTQTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
854
TMS320F28377DZWTQRTMS320F28377DZWTQRTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,058
TMS320F28377DZWTSTMS320F28377DZWTSTexas InstrumentsIC MCU 32BIT 1MB FLASH 337NFBGAMicrocontrollers337-NFBGA (16x16)N/A-40°C ~ 125°C (TJ)
Core Processor:
C28x
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, uPP, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
169
Program Memory Size:
1MB (512K x 16)
Program Memory Type:
FLASH
RAM Size:
102K x 16
Voltage – Supply (Vcc/Vdd):
1.14V ~ 3.47V
Data Converters:
A/D 24x12b, 12x16b; D/A 3x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
337-NFBGA (16×16)
Package / Case:
337-LFBGA
1,324

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