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Total Products: 236,805
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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DSPIC33EP256GM306-E/MR
DSPIC33EP256GM306-E/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
318
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DSPIC33EP256GM306-E/PT
DSPIC33EP256GM306-E/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
396
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DSPIC33EP256GM306-H/MR
DSPIC33EP256GM306-H/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
746
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DSPIC33EP256GM306-H/PT
DSPIC33EP256GM306-H/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
1,724
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DSPIC33EP256GM306-I/MR
DSPIC33EP256GM306-I/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
370
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DSPIC33EP256GM306-I/PT
DSPIC33EP256GM306-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
758
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DSPIC33EP256GM306T-I/MR
DSPIC33EP256GM306T-I/MRMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
256
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DSPIC33EP256GM306T-I/PT
DSPIC33EP256GM306T-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
421
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DSPIC33EP256GM310-E/BG
DSPIC33EP256GM310-E/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
455
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DSPIC33EP256GM310-E/PF
DSPIC33EP256GM310-E/PFMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
770
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DSPIC33EP256GM310-E/PT
DSPIC33EP256GM310-E/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,072
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DSPIC33EP256GM310-H/BG
DSPIC33EP256GM310-H/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
469
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DSPIC33EP256GM310-H/PF
DSPIC33EP256GM310-H/PFMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,149
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DSPIC33EP256GM310-H/PT
DSPIC33EP256GM310-H/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
912
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DSPIC33EP256GM310-I/BG
DSPIC33EP256GM310-I/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
87
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DSPIC33EP256GM310-I/PF
DSPIC33EP256GM310-I/PFMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
47
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DSPIC33EP256GM310-I/PT
DSPIC33EP256GM310-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,069
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DSPIC33EP256GM310T-I/BG
DSPIC33EP256GM310T-I/BGMicrochip TechnologyIC MCU 16BIT 256KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
691
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DSPIC33EP256GM310T-I/PF
DSPIC33EP256GM310T-I/PFMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
798
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DSPIC33EP256GM310T-I/PT
DSPIC33EP256GM310T-I/PTMicrochip TechnologyIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,264
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