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Total Products: 236,805
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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DSPIC33EP512GM310-H/PT
DSPIC33EP512GM310-H/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
650
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DSPIC33EP512GM310-I/BG
DSPIC33EP512GM310-I/BGMicrochip TechnologyIC MCU 16BIT 512KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
154
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DSPIC33EP512GM310-I/PF
DSPIC33EP512GM310-I/PFMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
109
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DSPIC33EP512GM310-I/PT
DSPIC33EP512GM310-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
118
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DSPIC33EP512GM310T-I/BG
DSPIC33EP512GM310T-I/BGMicrochip TechnologyIC MCU 16BIT 512KB FLSH 121TFBGAMicrocontrollers121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-TFBGA (10×10)
Package / Case:
121-TFBGA
1,696
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DSPIC33EP512GM310T-I/PF
DSPIC33EP512GM310T-I/PFMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
408
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DSPIC33EP512GM310T-I/PT
DSPIC33EP512GM310T-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 49x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
934
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DSPIC33EP512GM604-E/ML
DSPIC33EP512GM604-E/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
309
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DSPIC33EP512GM604-E/PT
DSPIC33EP512GM604-E/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
1,239
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DSPIC33EP512GM604-H/ML
DSPIC33EP512GM604-H/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
609
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DSPIC33EP512GM604-H/PT
DSPIC33EP512GM604-H/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
86
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DSPIC33EP512GM604-I/ML
DSPIC33EP512GM604-I/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
26
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DSPIC33EP512GM604-I/PT
DSPIC33EP512GM604-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
1,181
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DSPIC33EP512GM604T-I/ML
DSPIC33EP512GM604T-I/MLMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44QFNMicrocontrollers44-QFN (8x8)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFN (8×8)
Package / Case:
44-VQFN Exposed Pad
307
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DSPIC33EP512GM604T-I/PT
DSPIC33EP512GM604T-I/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 44TQFPMicrocontrollers44-TQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 18x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-TQFP (10×10)
Package / Case:
44-TQFP
338
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DSPIC33EP512GM706-E/MR
DSPIC33EP512GM706-E/MRMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,069
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DSPIC33EP512GM706-E/PT
DSPIC33EP512GM706-E/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
60 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
408
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DSPIC33EP512GM706-H/MR
DSPIC33EP512GM706-H/MRMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
372
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DSPIC33EP512GM706-H/PT
DSPIC33EP512GM706-H/PTMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64TQFPMicrocontrollers64-TQFP (10x10)N/A-40°C ~ 150°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
64-TQFP (10×10)
Package / Case:
64-TQFP
1,148
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DSPIC33EP512GM706-I/MR
DSPIC33EP512GM706-I/MRMicrochip TechnologyIC MCU 16BIT 512KB FLASH 64VQFNMicrocontrollers64-VQFN (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
70 MIPs
Connectivity:
CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 30x10b/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-VQFN (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,000
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