| N/A | N/A | IPQ-9570-2-MSP615-MT-01-0 | Qualcomm | IPQ-9570-2-MSP615-MT-01-0 | RF Transceiver ICs | N/A | N/A | N/A | N/A | 1,006 | |
| N/A | N/A | IPQ-9570-2-MSP615-TR-01-0 | Qualcomm | INTERNET PROCESSOR, QUADA73 (2.2 | RF Transceiver ICs | N/A | N/A | N/A | N/A | 458 | |
| N/A | N/A | IPQ-9570-3-MSP615-TR-01-0 | Qualcomm | IPQ-9570-3-MSP615-TR-01-0 | RF Transceiver ICs | N/A | N/A | N/A | N/A | 986 | |
 | | IS1870SF-102 | Microchip Technology | BLUETOOTH BLE IC 6X6MM I-TEMP | RF Transceiver ICs | 48-QFN (6x6) | 1.9V ~ 3.6V | -20°C ~ 70°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 13mA Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (6×6) | 257 | |
 | | IS1870SF-102-TRAY | Microchip Technology | BLUETOOTH BLE IC 6X6MM I-TEMP | RF Transceiver ICs | 48-QFN (6x6) | 1.9V ~ 3.6V | -20°C ~ 70°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 13mA Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (6×6) | 774 | |
 | | IS1870SF-202 | Microchip Technology | BLUETOOTH BLE5 IC 6X6MM | RF Transceiver ICs | 48-QFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 85°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 10mA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (6×6) | 346 | |
 | | IS1870SF-202-TRAY | Microchip Technology | BLUETOOTH BLE5 IC 6X6MM | RF Transceiver ICs | 48-QFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 85°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 10mA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (6×6) | 289 | |
 | | IS1871SF-102 | Microchip Technology | BLUETOOTH BLE5 IC 4X4MM | RF Transceiver ICs | 32-QFN (4x4) | 1.9V ~ 3.6V | -20°C ~ 70°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 13mA Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 564 | |
 | | IS1871SF-102-TRAY | Microchip Technology | BLUETOOTH BLE5 IC 4X4MM | RF Transceiver ICs | 32-QFN (4x4) | 1.9V ~ 3.6V | -20°C ~ 70°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 13mA Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 53 | |
 | | IS1871SF-202 | Microchip Technology | BLUETOOTH BLE5 IC 4X4MM | RF Transceiver ICs | 32-QFN (4x4) | 1.9V ~ 3.6V | -40°C ~ 85°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 10mA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 708 | |
 | | IS1871SF-202-TRAY | Microchip Technology | BLUETOOTH BLE5 IC 4X4MM | RF Transceiver ICs | 32-QFN (4x4) | 1.9V ~ 3.6V | -40°C ~ 85°C (TA) | RF Family/Standard: Bluetooth Frequency: 2.402GHz ~ 2.48GHz Data Rate (Max): 921.6kbps Memory Size: 256kB Flash, 32kB ROM, 24kB SRAM Serial Interfaces: ADC, I2C, PWM, SPI, UART Voltage – Supply: 1.9V ~ 3.6V Current – Transmitting: 10mA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4×4) | 427 | |
| N/A | N/A | IS2008S-203 | Microchip Technology | BLUETOOTH | RF Transceiver ICs | 48-QFN (6x6) | 1.22V ~ 1.34V | -20°C ~ 70°C | RF Family/Standard: Bluetooth Protocol: Bluetooth v4.1 + EDR Modulation: 8DPSK, DQPSK, GFSK Memory Size: 148kB RAM, 606kB ROM Serial Interfaces: I2S, UART Voltage – Supply: 1.22V ~ 1.34V Operating Temperature: -20°C ~ 70°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (6×6) | 807 | |
 | N/A | IS21EF04GP-BCLI | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 1,812 | |
 | N/A | IS21EF04GP-BCLI-TR | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 820 | |
 | N/A | IS21EF04GP-JCLI | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, ROHS, | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 833 | |
 | N/A | IS21EF04GP-JCLI-TR | Integrated Silicon Solution Inc | 4GB, 153 BALL FBGA, 3.3V, ROHS, | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 1,304 | |
 | N/A | IS21EF04GP-JQLI | Integrated Silicon Solution Inc | 4GB, 100 BALL FBGA, 3.3V, ROHS, | Flash Memory | 100-LFBGA (14x18) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 38 | |
 | N/A | IS21EF04GP-JQLI-TR | Integrated Silicon Solution Inc | 4GB, 100 BALL FBGA, 3.3V, ROHS, | Flash Memory | 100-LFBGA (14x18) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 4G x 8 Technology: FLASH - NAND (pSLC) Write Cycle Time Word Page: N/A | 790 | |
 | N/A | IS21EF08G-BCLI | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 1,026 | |
 | N/A | IS21EF08G-BCLI-TR | Integrated Silicon Solution Inc | 8GB, 153 BALL FBGA, 3.3V, BOOT P | Flash Memory | 153-VFBGA (11.5x13) | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Memory Interface: eMMC_5.1 Memory Organization: 8G x 8 Technology: FLASH - NAND (MLC) Write Cycle Time Word Page: N/A | 122 | |