 | | K32W041AMZ | NXP Semiconductors | IC MCU K32W041 MCM 40HVQFN | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 279 | |
 | | K32W041AY | NXP Semiconductors | IC MCU K32W041 +15DBM 40HVQFN | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 420 | |
 | | K32W041AZ | NXP Semiconductors | IC MCU K32W041 +15DBM 40HVQFN | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 747 | |
 | | K32W041K | NXP Semiconductors | K32W041 BLE/ZIGBEE SOC | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 1,128 | |
 | | K32W041Y | NXP Semiconductors | K32W041 BLE/ZIGBEE SOC | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 1,392 | |
 | | K32W041Z | NXP Semiconductors | K32W041 BLE/ZIGBEE SOC | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 49 | |
| N/A | N/A | K32W042S1M2CAVAR | NXP Semiconductors | MCU KINETIS BT5/FSK/THREAD WLCSP | Microcontrollers | 191-WLCSP (5.97x5.85) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 191-WLCSP (5.97×5.85) | 877 | |
| N/A | N/A | K32W042S1M2VPJAT | NXP Semiconductors | MCU KINETIS THREAD 176-VFBGA | Microcontrollers | 176-VFBGA | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA | 792 | |
| N/A | | K32W061-DK006 | NXP Semiconductors | K32W061-DK006 | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 945 | |
 | | K32W061K | NXP Semiconductors | K32W061 BLE/ZIGBEE SOC WITH NTAG | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 56 | |
 | | K32W061Y | NXP Semiconductors | K32W061 BLE/ZIGBEE SOC WITH NTAG | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 971 | |
 | | K32W061Z | NXP Semiconductors | K32W061 BLE/ZIGBEE SOC WITH NTAG | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 1,242 | |
 | | K32W1480VFTBR | NXP Semiconductors | K4W1 HVQFN48 | RF Transceiver ICs | 48-HVQFN (7x7) | 1.71V ~ 3.6V | -40°C ~ 105°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.2, Thread, Zigbee® Modulation: FSK, GFSK, GMSK, MSK Memory Size: 1MB Flash, 128kB SRAM Serial Interfaces: I2C, I2S, SPI, UART Voltage – Supply: 1.71V ~ 3.6V Current – Receiving: 8.7mA Current – Transmitting: 22.4mA Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7×7) | 1,293 | |
 | | K32W1480VFTBT | NXP Semiconductors | K4W1 HVQFN48 | RF Transceiver ICs | 48-HVQFN (7x7) | 1.71V ~ 3.6V | -40°C ~ 105°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.2, Thread, Zigbee® Modulation: FSK, GFSK, GMSK, MSK Memory Size: 1MB Flash, 128kB SRAM Serial Interfaces: I2C, I2S, SPI, UART Voltage – Supply: 1.71V ~ 3.6V Current – Receiving: 8.7mA Current – Transmitting: 22.4mA Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7×7) | 1,025 | |
 | | K4S510432D-UC75 | Samsung Semiconductor, Inc. | IC DRAM 512MBIT LVTTL 54TSOP II | DRAM Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Organization: 128M x 4 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 1,363 | |
 | | K4S510432D-UC75T00 | Samsung Semiconductor, Inc. | IC DRAM 512MBIT LVTTL 54TSOP II | DRAM Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Organization: 128M x 4 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 1,582 | |
 | N/A | K9S08SG16E1MTG | NXP Semiconductors | SAMPLE PACK DEVICE | Microcontrollers | N/A | N/A | N/A | N/A | 613 | |
| N/A | | KAB 2402102 NA31010 | Matsuo | FUSE BOARD MOUNT 24VDC 50A 2012[0805] | Fuse | N/A | 24 | -40~+125℃ | Operating Temperature: -40~+125℃ Mounting Type: Surface Mount | 1,519 | |
| N/A | | KAB 2402132 NA31010 | Matsuo | FUSE BOARD MOUNT 24VDC 50A 2012[0805] | Fuse | N/A | 24 | -40~+125℃ | Operating Temperature: -40~+125℃ Mounting Type: Surface Mount | 545 | |
| N/A | | KAB 2402162 NA31010 | Matsuo | FUSE BOARD MOUNT 24VDC 50A 2012[0805] | Fuse | N/A | 24 | -40~+125℃ | Operating Temperature: -40~+125℃ Mounting Type: Surface Mount | 966 | |