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Total Products: 236,805
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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LH75411N0Q100C0;55
LH75411N0Q100C0;55NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
32-Bit Single-Core
Speed:
84MHz
Connectivity:
EBI/EMI, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O:
76
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
806
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LH79520N0Q000B1,55
LH79520N0Q000B1,55NXP SemiconductorsIC MCU 32BIT ROMLESS 176LQFPMicrocontrollers176-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
32-Bit Single-Core
Speed:
77.4MHz
Connectivity:
EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (20×20)
Package / Case:
176-LQFP
923
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LH79520N0Q000B1;55
LH79520N0Q000B1;55NXP SemiconductorsIC MCU 32BIT ROMLESS 176LQFPMicrocontrollers176-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
32-Bit Single-Core
Speed:
77.4MHz
Connectivity:
EBI/EMI, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
DMA, LCD, POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (20×20)
Package / Case:
176-LQFP
576
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N/AN/ALH79524N0F100A1NXP SemiconductorsIC MCU 32BIT ROMLESS 208LFBGAMicrocontrollers208-LFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM720T™ RISC
Core Size:
32-Bit Single-Core
Speed:
76.205MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
108
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 1.9V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LFBGA (14×14)
Package / Case:
208-LFBGA
1,961
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LH79524N0F100A1,55
LH79524N0F100A1,55NXP SemiconductorsIC MCU 32BIT ROMLESS 208LFBGAMicrocontrollers208-LFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
32-Bit Single-Core
Speed:
76.2MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
108
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LFBGA (14×14)
Package / Case:
208-LFBGA
1,717
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LH79524N0F100A1;55
LH79524N0F100A1;55NXP SemiconductorsIC MCU 32BIT ROMLESS 208LFBGAMicrocontrollers208-LFBGA (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
32-Bit Single-Core
Speed:
76.2MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
108
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LFBGA (14×14)
Package / Case:
208-LFBGA
65
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N/AN/ALH79525N0Q100A1NXP SemiconductorsIC MCU 32BIT ROMLESS 176LQFPMicrocontrollers176-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM720T™ RISC
Core Size:
32-Bit Single-Core
Speed:
76.205MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 1.9V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (20×20)
Package / Case:
176-LQFP
189
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LH79525N0Q100A1;55
LH79525N0Q100A1;55NXP SemiconductorsIC MCU 32BIT ROMLESS 176LQFPMicrocontrollers176-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
32-Bit Single-Core
Speed:
76.2MHz
Connectivity:
EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
86
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.7V ~ 3.6V
Data Converters:
A/D 10x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (20×20)
Package / Case:
176-LQFP
550
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N/AN/ALH7A400N0G000B5NXP SemiconductorsIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals:
AC’97, DMA, LCD, POR, PWM, WDT
Number of I/O:
60
Program Memory Type:
ROMless
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V, 2V ~ 2.2V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (17×17)
Package / Case:
256-BGA
1,074
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LH7A400N0G000B5,55
LH7A400N0G000B5,55NXP SemiconductorsIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals:
AC’97, DMA, LCD, POR, PWM, WDT
Number of I/O:
60
Program Memory Type:
ROMless
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (17×17)
Package / Case:
256-BGA
1,077
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LH7A400N0G000B5;55
LH7A400N0G000B5;55NXP SemiconductorsIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals:
AC’97, DMA, LCD, POR, PWM, WDT
Number of I/O:
60
Program Memory Type:
ROMless
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (17×17)
Package / Case:
256-BGA
457
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LH7A404N0F000B3,55
LH7A404N0F000B3,55NXP SemiconductorsIC MCU 32BIT ROMLESS 324LFBGAMicrocontrollers324-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals:
AC’97, DMA, LCD, POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 9x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-LFBGA (17×17)
Package / Case:
324-LFBGA
1,861
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LH7A404N0F000B3;55
LH7A404N0F000B3;55NXP SemiconductorsIC MCU 32BIT ROMLESS 324LFBGAMicrocontrollers324-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals:
AC’97, DMA, LCD, POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 9x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-LFBGA (17×17)
Package / Case:
324-LFBGA
964
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LH7A404N0F092B3,55
LH7A404N0F092B3,55NXP SemiconductorsIC MCU 32BIT ROMLESS 324LFBGAMicrocontrollers324-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals:
AC’97, DMA, LCD, POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 9x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-LFBGA (17×17)
Package / Case:
324-LFBGA
778
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LH7A404N0F092B3;55
LH7A404N0F092B3;55NXP SemiconductorsIC MCU 32BIT ROMLESS 324LFBGAMicrocontrollers324-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals:
AC’97, DMA, LCD, POR, PWM, WDT
Number of I/O:
64
Program Memory Type:
ROMless
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 9x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-LFBGA (17×17)
Package / Case:
324-LFBGA
321
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LHT2W221MELB30
LHT2W221MELB30NichiconCAP ALUM 220UF ±20% 450V SNAP-INAluminum Electrolytic CapacitorsN/A450 V-40°C - 125°C
Applications:
General Purpose
Capacitance:
220 µF
ESR:
N/A
Height Seated (Max):
3.3 cm
Impedance:
N/A
Lead Spacing:
N/A
Lifetime @ Temp:
3000 h @ 125°C
Polarization:
Polar
Ratings:
N/A
Ripple Current High Frequency:
1.602 A @ 50 kHz
Ripple Current Low Frequency:
1.12 A @ 120 Hz
Size / Dimension:
30 x 30 mm
Surface Mount Land Size:
N/A
Tolerance:
-20%~20%
659
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LHT2W271MELB35
LHT2W271MELB35NichiconCAP ALUM 270UF ±20% 450V SNAP-INAluminum Electrolytic CapacitorsN/A450 V-40°C - 125°C
Applications:
General Purpose
Capacitance:
270 µF
ESR:
N/A
Height Seated (Max):
3.8 cm
Impedance:
N/A
Lead Spacing:
N/A
Lifetime @ Temp:
3000 h @ 125°C
Polarization:
Polar
Ratings:
N/A
Ripple Current High Frequency:
1.816 A @ 50 kHz
Ripple Current Low Frequency:
1.27 A @ 120 Hz
Size / Dimension:
35 x 30 mm
Surface Mount Land Size:
N/A
Tolerance:
-20%~20%
540
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LHT2W271MELC30
LHT2W271MELC30NichiconCAP ALUM 270UF ±20% 450V SNAP-INAluminum Electrolytic CapacitorsN/A450 V-40°C - 125°C
Applications:
General Purpose
Capacitance:
270 µF
ESR:
N/A
Height Seated (Max):
3.3 cm
Impedance:
N/A
Lead Spacing:
N/A
Lifetime @ Temp:
3000 h @ 125°C
Polarization:
Polar
Ratings:
N/A
Ripple Current High Frequency:
1.916 A @ 50 kHz
Ripple Current Low Frequency:
1.34 A @ 120 Hz
Size / Dimension:
30 x 35 mm
Surface Mount Land Size:
N/A
Tolerance:
-20%~20%
912
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LHT2W331MELB45
LHT2W331MELB45NichiconCAP ALUM 330UF ±20% 450V SNAP-INAluminum Electrolytic CapacitorsN/A450 V-40°C - 125°C
Applications:
General Purpose
Capacitance:
330 µF
ESR:
N/A
Height Seated (Max):
4.8 cm
Impedance:
N/A
Lead Spacing:
N/A
Lifetime @ Temp:
3000 h @ 125°C
Polarization:
Polar
Ratings:
N/A
Ripple Current High Frequency:
2.116 A @ 50 kHz
Ripple Current Low Frequency:
1.48 A @ 120 Hz
Size / Dimension:
45 x 30 mm
Surface Mount Land Size:
N/A
Tolerance:
-20%~20%
968
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LHT2W331MELC35
LHT2W331MELC35NichiconCAP ALUM 330UF ±20% 450V SNAP-INAluminum Electrolytic CapacitorsN/A450 V-40°C - 125°C
Applications:
General Purpose
Capacitance:
330 µF
ESR:
N/A
Height Seated (Max):
3.8 cm
Impedance:
N/A
Lead Spacing:
N/A
Lifetime @ Temp:
3000 h @ 125°C
Polarization:
Polar
Ratings:
N/A
Ripple Current High Frequency:
2.159 A @ 50 kHz
Ripple Current Low Frequency:
1.51 A @ 120 Hz
Size / Dimension:
35 x 35 mm
Surface Mount Land Size:
N/A
Tolerance:
-20%~20%
1,114
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