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Total Products: 236,805
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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LPC2917FBD144/01/,
LPC2917FBD144/01/,NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
356
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LPC2919FBD144,551
LPC2919FBD144,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,347
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LPC2919FBD144/01/,
LPC2919FBD144/01/,NXP SemiconductorsIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
830
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LPC2921FBD100,551
LPC2921FBD100,551NXP SemiconductorsLPC2900 - Arm9, 32-Bit RISC MicrMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
26
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LPC2923FBD100,551
LPC2923FBD100,551NXP SemiconductorsIC MCU 16/32B 256KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
315
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N/A
LPC2925FBD100,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
32-Bit
Speed:
125MHz
Connectivity:
CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
611
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LPC2926FBD144,551
LPC2926FBD144,551NXP SemiconductorsLPC2900 - Arm9, 32-Bit RISC MicrMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
888
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LPC2926FBD144,557
LPC2926FBD144,557NXP SemiconductorsLPC2926FBD144 - ARM9 microcontroMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
823
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LPC2927FBD144,551
LPC2927FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
513
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LPC2929FBD144,551
LPC2929FBD144,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
476
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LPC2930FBD208,551
LPC2930FBD208,551NXP SemiconductorsLPC2900 - Arm9, 32-Bit RISC MicrMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM968E-S
Core Size:
32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
152
Program Memory Type:
ROMless
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
559
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LPC2939FBD208,551
LPC2939FBD208,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
690
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LPC2939FET208,551N/ALPC2939FET208,551NXP SemiconductorsIC MCU 16/32B 768KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
125MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
56K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 24x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
386
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LPC3130FET180,551
LPC3130FET180,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
540
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N/A
LPC3131FET180,551NXP SemiconductorsLPC3131 - Low-cost, low-power ARMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.2V ~ 3.6V
Data Converters:
A/D 4x10b SAR
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,265
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LPC3141FET180,551
LPC3141FET180,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
270MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
20
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
98
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LPC3143FET180,551
LPC3143FET180,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM926EJ-S
Core Size:
16/32-Bit
Speed:
270MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
20
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,442
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LPC3152FET208,551
LPC3152FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
10
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 3x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
442
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LPC3154FET208,551
LPC3154FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
180MHz
Connectivity:
EBI/EMI, I2C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG
Peripherals:
DMA, I2S, LCD, PWM, WDT
Number of I/O:
10
Program Memory Type:
ROMless
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.6V
Data Converters:
A/D 3x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (12×12)
Package / Case:
208-TFBGA
433
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LPC3180FEL320/01,5
LPC3180FEL320/01,5NXP SemiconductorsIC MCU 16/32BIT ROMLESS 320LFBGAMicrocontrollers320-LFBGA (13x13)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
208MHz
Connectivity:
EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG
Peripherals:
DMA, PWM, WDT
Number of I/O:
55
Program Memory Type:
ROMless
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.1V ~ 3.3V
Data Converters:
A/D 3x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
320-LFBGA (13×13)
Package / Case:
320-LFBGA
962
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