 | | LPC43S67JET100E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 16x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 204 | |
 | | LPC43S67JET256E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 256LBGA | Microcontrollers | 256-LBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 16x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LBGA (17×17) | 89 | |
 | | LPC43S70FET100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 16x10b, 6x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 505 | |
 | | LPC43S70FET256E | NXP Semiconductors | IC MCU 32BIT ROMLESS 256LBGA | Microcontrollers | 256-LBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 3x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LBGA (17×17) | 1,094 | |
 | | LPC51U68JBD48E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 486 | |
 | | LPC51U68JBD48K | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: USART, SPIs, I2C, USB Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, DMA Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,923 | |
 | | LPC51U68JBD64EL | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: USART, SPIs, I2C, USB Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, DMA Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,446 | |
 | | LPC51U68JBD64QL | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 588 | |
 | | LPC54005JBD100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,169 | |
 | | LPC54005JET100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 40 | |
 | | LPC54016JBD100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 757 | |
| N/A | | LPC54016JBD100Y | NXP Semiconductors | LPC54016JBD100 | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 206 | |
 | | LPC54016JBD208E | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 150 | |
| N/A | | LPC54016JBD208K | NXP Semiconductors | LPC54016JBD208 | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 256 | |
| N/A | | LPC54016JBD208MP | NXP Semiconductors | LPC54016JBD208 | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4F Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,023 | |
 | | LPC54016JET100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,438 | |
| N/A | N/A | LPC54016JET180 | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 184 | |
 | | LPC54016JET180E | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 615 | |
 | | LPC54018J2MET180E | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,027 | |
 | | LPC54018J4MET180E | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 990 | |