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| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | N/A | AGLE600V2-FGG256I | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.14 V - 1.575 V | -40°C – 85°C | Grade: Industrial Number of Gates: 600000 Number of I/O: 165 Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 Qualification: N/A Total RAM Bits: 110592 | 1,136 | |
 | AGLE600V5-FG256 | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of Logic Elements/Cells: 13824 Total RAM Bits: 110592 Number of I/O: 165 Number of Gates: 600000 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17×17) | 1,031 | ||
 | N/A | AGLE600V5-FG256I | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425 V - 1.575 V | -40°C – 85°C | Grade: Industrial Number of Gates: 600000 Number of I/O: 165 Number of LABs/CLBs: 13824 Number of Logic Elements/Cells: 13824 Qualification: N/A Total RAM Bits: 110592 | 731 | |
 | AGLE600V5-FGG256 | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of Logic Elements/Cells: 13824 Total RAM Bits: 110592 Number of I/O: 165 Number of Gates: 600000 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17×17) | 334 | ||
 | AGLE600V5-FGG256I | Microchip Technology | IC FPGA 165 I/O 256FBGA | FPGAs | 256-FPBGA (17x17) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of Logic Elements/Cells: 13824 Total RAM Bits: 110592 Number of I/O: 165 Number of Gates: 600000 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-FPBGA (17×17) | 859 | ||
 | AGLN010V2-QNG48 | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.14 V - 1.575 V | -20°C – 85°C | Grade: Commercial Number of Gates: 10000 Number of I/O: 34 Number of LABs/CLBs: 260 Number of Logic Elements/Cells: 260 Qualification: N/A | 158 | ||
 | AGLN010V2-QNG48I | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 260 Number of I/O: 34 Number of Gates: 10000 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (6×6) | 951 | ||
 | AGLN010V2-UCG36 | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.14 V - 1.575 V | -20°C – 85°C | Grade: Commercial Number of Gates: 10000 Number of I/O: 23 Number of LABs/CLBs: 260 Number of Logic Elements/Cells: 260 Qualification: N/A | 897 | ||
 | AGLN010V2-UCG36I | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 260 Number of I/O: 23 Number of Gates: 10000 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 36-WFBGA, CSPBGA Supplier Device Package: 36-UCSP (3×3) | 179 | ||
 | AGLN010V5-QNG48 | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.425 V - 1.575 V | -20°C – 85°C | Grade: Commercial Number of Gates: 10000 Number of I/O: 34 Number of LABs/CLBs: 260 Number of Logic Elements/Cells: 260 Qualification: N/A | 383 | ||
 | AGLN010V5-QNG48I | Microchip Technology | IC FPGA 34 I/O 48QFN | FPGAs | 48-QFN (6x6) | 1.425 V - 1.575 V | -40°C – 100°C | Grade: Industrial Number of Gates: 10000 Number of I/O: 34 Number of LABs/CLBs: 260 Number of Logic Elements/Cells: 260 Qualification: N/A | 32 | ||
 | AGLN010V5-UCG36 | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.425V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 260 Number of I/O: 23 Number of Gates: 10000 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 36-WFBGA, CSPBGA Supplier Device Package: 36-UCSP (3×3) | 203 | ||
 | AGLN010V5-UCG36I | Microchip Technology | IC FPGA 23 I/O 36UCSP | FPGAs | 36-UCSP (3x3) | 1.425 V - 1.575 V | -40°C – 100°C | Grade: Industrial Number of Gates: 10000 Number of I/O: 23 Number of LABs/CLBs: 260 Number of Logic Elements/Cells: 260 Qualification: N/A | 669 | ||
 | AGLN015V2-QNG68 | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.14V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 384 Number of I/O: 49 Number of Gates: 15000 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 30 | ||
 | AGLN015V2-QNG68I | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 384 Number of I/O: 49 Number of Gates: 15000 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 452 | ||
 | AGLN015V5-QNG68 | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.425V ~ 1.575V | -20°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 384 Number of I/O: 49 Number of Gates: 15000 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -20°C ~ 85°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 833 | ||
 | AGLN015V5-QNG68I | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.425V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 384 Number of I/O: 49 Number of Gates: 15000 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 340 | ||
 | AGLN020V2-CSG81 | Microchip Technology | IC FPGA 52 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.14 V - 1.575 V | -20°C – 85°C | Grade: Commercial Number of Gates: 20000 Number of I/O: 52 Number of LABs/CLBs: 520 Number of Logic Elements/Cells: 520 Qualification: N/A | 1,483 | ||
 | AGLN020V2-CSG81I | Microchip Technology | IC FPGA 52 I/O 81CSP | FPGAs | 81-CSP (5x5) | 1.14V ~ 1.575V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 520 Number of I/O: 52 Number of Gates: 20000 Voltage – Supply: 1.14V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 81-WFBGA, CSBGA Supplier Device Package: 81-CSP (5×5) | 1,337 | ||
 | AGLN020V2-QNG68 | Microchip Technology | IC FPGA 49 I/O 68QFN | FPGAs | 68-QFN (8x8) | 1.14 V - 1.575 V | -20°C – 85°C | Grade: Commercial Number of Gates: 20000 Number of I/O: 49 Number of LABs/CLBs: 520 Number of Logic Elements/Cells: 520 Qualification: N/A | 1,222 |
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