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Total Products: 8,639
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/AN/ASAC57D52LCVLTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
521
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N/AN/ASAC57D52LCVLTRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
64
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N/AN/ASAC57D53MCVLTNXP SemiconductorsIC MCU 32BIT 3MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
134
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N/AN/ASAC57D53MCVLTRNXP SemiconductorsIC MCU 32BIT 3MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
1,027
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SAC57D53MCVMON/ASAC57D53MCVMONXP SemiconductorsIC MCU 32BIT 3MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
754
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SAC57D53MCVMORN/ASAC57D53MCVMORNXP SemiconductorsIC MCU 32BIT 3MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
165
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SAC57D54HCVLTN/ASAC57D54HCVLTNXP SemiconductorsIC MCU 32BIT 4MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
1,100
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N/AN/ASAC57D54HCVLTRNXP SemiconductorsIC MCU 32BIT 4MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP Exposed Pad
41
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SAC57D54HCVMON/ASAC57D54HCVMONXP SemiconductorsIC MCU 32BIT 4MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,586
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QUOTE
SAC57D54HCVMORN/ASAC57D54HCVMORNXP SemiconductorsIC MCU 32BIT 4MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A5/M4/M0+
Core Size:
32-Bit Tri-Core
Speed:
80MHz, 160MHz, 320MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI
Peripherals:
DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
RAM Size:
2.3M x 8
Voltage – Supply (Vcc/Vdd):
3.15V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,713
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QUOTE
N/AN/ASC439639VAB25RNXP SemiconductorsIC MCU 32BITMicrocontrollersN/AN/A–

N/A

421
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QUOTE
SC511660MZP40N/ASC511660MZP40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
762
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SC511663MZP40N/ASC511663MZP40NXP SemiconductorsIC MCU 32BIT 448KB FLASH 272PBGAMicrocontrollers272-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
RAM Size:
26K x 8
Voltage – Supply (Vcc/Vdd):
2.5V ~ 2.7V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-PBGA (27×27)
Package / Case:
272-BBGA
1,037
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SC5554MVR132
SC5554MVR132NXP SemiconductorsIC MCU 32BIT 2MB FLASH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z6
Core Size:
32-Bit Single-Core
Speed:
132MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
256
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Data Converters:
A/D 40x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
360
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SC68376BACAB20
SC68376BACAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
662
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SC68376BACAB25
SC68376BACAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
547
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QUOTE
SC68376BAMAB20
SC68376BAMAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
729
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QUOTE
SC68376BAVAB25
SC68376BAVAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
681
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QUOTE
SC68376BGCAB20
SC68376BGCAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,665
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QUOTE
SC68376BGCAB25
SC68376BGCAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
228
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