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Total Products: 8,639
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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SPC5777CRK3MMO3
SPC5777CRK3MMO3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,460
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SPC5777CSK3MME3
SPC5777CSK3MME3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
927
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SPC5777CSK3MME3R
SPC5777CSK3MME3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
997
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N/AN/ASPC5777CSK3MME4NXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
608
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N/AN/ASPC5777CSK3MME4RNXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V, 4.5V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
786
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SPC5777CSK3MMO3
SPC5777CSK3MMO3NXP SemiconductorsIC MCU 32BIT 8MB FLASH 516MAPBGAMicrocontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,642
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SPC5777CSK3MMO3R
SPC5777CSK3MMO3RNXP SemiconductorsIC MCU 32BIT 8MB FLASH 416MAPBGAMicrocontrollers416-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
264MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16b Sigma-Delta, eQADC
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-MAPBGA (27×27)
Package / Case:
416-BGA
1,834
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N/AN/ASPC5777CSK3MMO4NXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
715
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N/AN/ASPC5777CSK3MMO4RNXP SemiconductorsPOWER ARCH CORES, 8MB FLASH, 300Microcontrollers516-MAPBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, PSI5, SENT, SPI
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
512K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x16b Sigma-Delta, eQADC
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
516-MAPBGA (27×27)
Package / Case:
516-BGA
1,219
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SPC5777MK0MVA8
SPC5777MK0MVA8NXP SemiconductorsIC MCU 32B 8.64MB FLSH 512TEPBGAMicrocontrollers512-FBGA (25x25)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8.64MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
404K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
512-FBGA (25×25)
Package / Case:
512-FBGA
405
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N/A
SPC5777MK0MVA8RNXP SemiconductorsIC MCU 32B 8.64MB FLSH 512TEPBGAMicrocontrollers512-FBGA (25x25)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8.64MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
404K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
512-FBGA (25×25)
Package / Case:
512-FBGA
1,681
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SPC5777MK0MVU8
SPC5777MK0MVU8NXP SemiconductorsIC MCU 32BIT 8.64MB FLSH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8.64MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
404K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
1,827
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SPC5777MK0MVU8R
SPC5777MK0MVU8RNXP SemiconductorsIC MCU 32BIT 8.64MB FLSH 416PBGAMicrocontrollers416-PBGA (27x27)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z7
Core Size:
32-Bit Tri-Core
Speed:
300MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexRAY, I2C, LINbus, SPI, PSI, UART/USART
Peripherals:
DMA, LVD, POR, Zipwire
Program Memory Size:
8.64MB (8M x 8)
Program Memory Type:
FLASH
RAM Size:
404K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12b SAR, 16b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
416-PBGA (27×27)
Package / Case:
416-BBGA
183
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XC68C812A4PVE5
XC68C812A4PVE5NXP SemiconductorsIC MCU 16BIT 4KB EEPROM 112LQFPMicrocontrollers112-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
83
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
EEPROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
98
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XC68HC705B32CB
XC68HC705B32CBNXP SemiconductorsIC MCU 8BIT 32KB OTP 56PSDIPMicrocontrollers56-PSDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
528 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
56-PSDIP
Package / Case:
56-SDIP (0.600″”, 15.24mm)
70
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XC68HC705B32CFN
XC68HC705B32CFNNXP SemiconductorsIC MCU 8BIT 32KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
528 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
179
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XC705B32CBE
XC705B32CBENXP SemiconductorsIC MCU 8BIT 32KB OTP 56PSDIPMicrocontrollers56-PSDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
528 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
56-PSDIP
Package / Case:
56-SDIP (0.600″”, 15.24mm)
888
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XC705B32CFNE
XC705B32CFNENXP SemiconductorsIC MCU 8BIT 32KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
528 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
183
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XC912BC32CFUE8
XC912BC32CFUE8NXP SemiconductorsIC MCU 16BIT 32KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
768 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
566
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