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Total Products: 8,639
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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LPC18S10FET100E
LPC18S10FET100ENXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
187
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LPC18S10FET180EN/ALPC18S10FET180ENXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,533
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LPC18S30FBD144EN/ALPC18S30FBD144ENXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
883
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LPC18S30FET100EN/ALPC18S30FET100ENXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
834
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LPC18S30FET256E
LPC18S30FET256ENXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
776
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LPC18S37JBD144EN/ALPC18S37JBD144ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,401
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LPC18S37JET100E
LPC18S37JET100ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
66
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LPC18S50FET180E
LPC18S50FET180ENXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
118
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
92
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LPC18S50FET256,551
LPC18S50FET256,551NXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
1,185
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LPC18S57JBD208EN/ALPC18S57JBD208ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
142
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
803
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LPC18S57JET256E
LPC18S57JET256ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
47
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LPC2101FBD48,151
LPC2101FBD48,151NXP SemiconductorsIC MCU 16/32BIT 8KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
750
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LPC2102FBD48,118
LPC2102FBD48,118NXP SemiconductorsIC MCU 16/32BIT 16KB FLSH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
578
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LPC2102FBD48,151
LPC2102FBD48,151NXP SemiconductorsIC MCU 16/32BIT 16KB FLSH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
336
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LPC2102FHN48,551
LPC2102FHN48,551NXP SemiconductorsIC MCU 16/32B 16KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
284
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LPC2103FBD48,118
LPC2103FBD48,118NXP SemiconductorsIC MCU 16/32BIT 32KB FLSH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,076
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LPC2103FBD48,151
LPC2103FBD48,151NXP SemiconductorsIC MCU 16/32BIT 32KB FLSH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
698
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LPC2103FBD48EL
LPC2103FBD48ELNXP SemiconductorsIC MCU 16/32BIT 32KB FLSH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
A/D 8x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,178
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LPC2103FHN48,551
LPC2103FHN48,551NXP SemiconductorsIC MCU 16/32B 32KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,579
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LPC2103FHN48H/6,51
LPC2103FHN48H/6,51NXP SemiconductorsIC MCU 16/32B 32KB FLASH 48HVQFNMicrocontrollers48-HVQFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
70MHz
Connectivity:
I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (6×6)
Package / Case:
48-VFQFN Exposed Pad
139
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