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Total Products: 8,639
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
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LPC2366FBD100,551LPC2366FBD100,551NXP SemiconductorsIC MCU 16/32B 256KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
927
LPC2366FBD100KLPC2366FBD100KNXP SemiconductorsIC MCU 16/32B 256KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
848
LPC2367FBD100,551LPC2367FBD100,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
519
N/ALPC2368FBD100,518NXP SemiconductorsIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7TDMI-S
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b SAR; D/A 1x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
158
LPC2368FBD100,551LPC2368FBD100,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
485
LPC2368FBD100KLPC2368FBD100KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
93
LPC2368FET100,518LPC2368FET100,518NXP SemiconductorsIC MCU 16/32BIT 512KB 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
102
LPC2377FBD144,551LPC2377FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
EBI/EMI, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
294
LPC2378FBD144,551LPC2378FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
4
LPC2378FBD144KLPC2378FBD144KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
58K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b SAR; D/A 1x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
818
LPC2387FBD100,551LPC2387FBD100,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
421
LPC2387FBD100KLPC2387FBD100KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,346
LPC2388FBD144,551LPC2388FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
388
LPC2388FBD144KLPC2388FBD144KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
42
LPC2420FBD208,551LPC2420FBD208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
82K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
479
LPC2420FBD208KLPC2420FBD208KNXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
82K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
130
LPC2420FET208,551LPC2420FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
82K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
1,129
LPC2458FET180,551LPC2458FET180,551NXP SemiconductorsIC MCU 16/32BIT 512KB 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,264
LPC2460FBD208,551LPC2460FBD208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,484
LPC2460FET208,551LPC2460FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
194

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