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Total Products: 8,639
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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LPC5504JBD64E
LPC5504JBD64ENXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
956
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N/A
LPC5504JBD64KNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
202
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N/A
LPC5504JBD64YNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
878
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LPC5504JHI48EL
LPC5504JHI48ELNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,136
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LPC5504JHI48J
LPC5504JHI48JNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,859
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LPC5504JHI48QL
LPC5504JHI48QLNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
645
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LPC5506JBD64E
LPC5506JBD64ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
520
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N/A
LPC5506JBD64KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
92
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N/A
LPC5506JBD64YNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
827
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QUOTE
LPC5506JHI48EL
LPC5506JHI48ELNXP SemiconductorsIC MCU 32BIT 256KB FLASH 48VFQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
818
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QUOTE
LPC5506JHI48J
LPC5506JHI48JNXP SemiconductorsIC MCU 32BIT 256KB FLASH 48VFQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
105
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QUOTE
LPC5506JHI48QL
LPC5506JHI48QLNXP SemiconductorsIC MCU 32BIT 256KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
163
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LPC5512JBD100E
LPC5512JBD100ENXP SemiconductorsIC MCU 32BIT 64KB FLASH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,623
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QUOTE
N/A
LPC5512JBD100KNXP SemiconductorsIC MCU 32BIT 64KB FLASH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
709
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QUOTE
N/A
LPC5512JBD100YNXP SemiconductorsIC MCU 32BIT 64KB FLASH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
236
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LPC5512JBD64E
LPC5512JBD64ENXP SemiconductorsIC MCU 32BIT 64KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
432
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QUOTE
N/A
LPC5512JBD64KNXP SemiconductorsIC MCU 32BIT 64KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
822
GET A
QUOTE
N/A
LPC5512JBD64YNXP SemiconductorsIC MCU 32BIT 64KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
495
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QUOTE
LPC5514JBD100E
LPC5514JBD100ENXP SemiconductorsIC MCU 32BIT 128KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
212
GET A
QUOTE
N/A
LPC5514JBD100KNXP SemiconductorsIC MCU 32BIT 128KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
243
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QUOTE

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