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Total Products: 8,639
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/A
LPC5534JBD64MPNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 13x16b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
165
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LPC5534JHI48/00E
LPC5534JHI48/00ENXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,410
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LPC5534JHI48/00K
LPC5534JHI48/00KNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
503
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LPC5534JHI48/00MP
LPC5534JHI48/00MPNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,376
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LPC5536JBD100E
LPC5536JBD100ENXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 23x16b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP
609
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LPC5536JBD100K
LPC5536JBD100KNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 23x16b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP
1,078
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N/A
LPC5536JBD100MPNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 23x16b; D/A 2x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
400
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LPC5536JBD64E
LPC5536JBD64ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 13x16b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
775
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LPC5536JBD64K
LPC5536JBD64KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 13x16b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
650
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N/A
LPC5536JBD64MPNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 13x16b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
1,746
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LPC5536JHI48/00E
LPC5536JHI48/00ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
722
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LPC5536JHI48/00K
LPC5536JHI48/00KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
921
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LPC5536JHI48/00MP
LPC5536JHI48/00MPNXP SemiconductorsIC MCU 32BIT 256KB FLASH 48VFQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
440
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LPC55S04JBD64E
LPC55S04JBD64ENXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
314
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N/A
LPC55S04JBD64KNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
796
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N/A
LPC55S04JBD64YNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
601
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LPC55S04JHI48EL
LPC55S04JHI48ELNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
143
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LPC55S04JHI48J
LPC55S04JHI48JNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,513
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LPC55S04JHI48QL
LPC55S04JHI48QLNXP SemiconductorsIC MCU 32BIT 128KB FLASH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
30
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 7x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
623
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QUOTE
LPC55S06JBD64E
LPC55S06JBD64ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
96MHz
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x16b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
1,164
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QUOTE

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