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Total Products: 8,639
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/A
LPC55S36JBD100ENXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 23x16b; D/A 3x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP
32
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N/A
LPC55S36JBD100KNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 23x16b; D/A 3x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP
446
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N/A
LPC55S36JBD100MPNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
66
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 23x16b; D/A 3x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP
1,954
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LPC55S36JHI48E
LPC55S36JHI48ENXP SemiconductorsIC MCU 32BIT 256KB FLSH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
731
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LPC55S36JHI48K
LPC55S36JHI48KNXP SemiconductorsIC MCU 32BIT 256KB FLSH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
427
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LPC55S36JHI48MP
LPC55S36JHI48MPNXP SemiconductorsIC MCU 32BIT 256KB FLSH 48HVQFNMicrocontrollers48-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
32
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
48-HVQFN (7×7)
Package / Case:
48-VFQFN Exposed Pad
897
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N/A
LPC55S66JBD100ENXP SemiconductorsIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
749
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LPC55S66JBD100K
LPC55S66JBD100KNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
650
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N/A
LPC55S66JBD100YNXP SemiconductorsIC MCU 32BIT 256KB FLSH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
1,895
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LPC55S66JBD64E
LPC55S66JBD64ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
603
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LPC55S66JBD64K
LPC55S66JBD64KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
1,175
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N/A
LPC55S66JBD64YNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64TQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
1,932
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N/A
LPC55S66JEV98ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 98VFBGAMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
762
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LPC55S66JEV98K
LPC55S66JEV98KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 98VFBGAMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
1,618
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N/A
LPC55S66JEV98YNXP SemiconductorsIC MCU 32BIT 256KB FLASH 98VFBGAMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
689
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N/A
LPC55S69JBD100ENXP SemiconductorsIC MCU 32BIT 640KB FLASH 100LQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
401
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N/A
LPC55S69JBD100KNXP SemiconductorsIC MCU 32BIT 640KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP
1,178
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LPC55S69JBD100Y
LPC55S69JBD100YNXP SemiconductorsIC MCU 32BIT 640KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
180
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N/A
LPC55S69JBD64ENXP SemiconductorsIC MCU 32BIT 640KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
64
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QUOTE
LPC55S69JBD64K
LPC55S69JBD64KNXP SemiconductorsIC MCU 32BIT 640KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
984
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