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Total Products: 8,639
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
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MC68376BGMAB20MC68376BGMAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
944
MC68376BGMFT20MC68376BGMFT20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,621
MC68376BGVAB25MC68376BGVAB25NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
2
MC68711E20CFNE2N/AMC68711E20CFNE2NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
547
MC68711E20CFNE3N/AMC68711E20CFNE3NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,189
MC68711E20CFNE4N/AMC68711E20CFNE4NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
846
MC68711E20CFUE3MC68711E20CFUE3NXP SemiconductorsIC MCU 8BIT 20KB OTP 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
578
MC68711E20MFNE2N/AMC68711E20MFNE2NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
673
MC68711E20MFNE3N/AMC68711E20MFNE3NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
564
MC68711E20VFNE2N/AMC68711E20VFNE2NXP SemiconductorsIC MCU 8BIT 20KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
20KB (20K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
450
MC68908GR16CFJEMC68908GR16CFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
560
MC68908GR16MFJEMC68908GR16MFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,390
MC68908GR16VFJEMC68908GR16VFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,281
MC68908GZ16CFJEMC68908GZ16CFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
52
MC68908GZ16MFJEMC68908GZ16MFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,017
MC68908GZ16VFJEMC68908GZ16VFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
732
MC68908GZ8CFAEMC68908GZ8CFAENXP SemiconductorsIC MCU 8BIT 8KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
37
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
174
MC68908GZ8CFJEMC68908GZ8CFJENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
757
MC68908GZ8CFJERMC68908GZ8CFJERNXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
540
MC68908GZ8MFAEMC68908GZ8MFAENXP SemiconductorsIC MCU 8BIT 8KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
37
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,737

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