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Total Products: 8,639
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68908GZ8MFJEMC68908GZ8MFJENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
278
MC68908GZ8VFAEMC68908GZ8VFAENXP SemiconductorsIC MCU 8BIT 8KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
37
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,447
MC68908GZ8VFJEMC68908GZ8VFJENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
21
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,054
MC68CK16Z1CAG16MC68CK16Z1CAG16NXP SemiconductorsIC MCU 16BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
356
MC68CK331CAG16MC68CK331CAG16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
781
N/AMC68F375BGMVR33NXP SemiconductorsIC MCU 32BIT 256KB FLASH 217PBGAMicrocontrollers217-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
33MHz
Connectivity:
CANbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
217-PBGA (23×23)
Package / Case:
217-BBGA
1,938
N/AMC68F375BGMZP33NXP SemiconductorsIC MCU 32BIT 256KB FLASH 217PBGAMicrocontrollers217-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
33MHz
Connectivity:
CANbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
217-PBGA (23×23)
Package / Case:
217-BBGA
582
N/AMC68F375MZP33R2NXP SemiconductorsIC MCU 32BIT 256KB FLASH 217PBGAMicrocontrollers217-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
33MHz
Connectivity:
CANbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
217-PBGA (23×23)
Package / Case:
217-BBGA
581
MC68HC11A0CFNE3MC68HC11A0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
292
MC68HC11A1CFNE3MC68HC11A1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
565
MC68HC11A1CFNE3RMC68HC11A1CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,686
MC68HC11A1MFNEMC68HC11A1MFNENXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
684
MC68HC11A1MFNERMC68HC11A1MFNERNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
208
MC68HC11D0CFBE2MC68HC11D0CFBE2NXP SemiconductorsIC MCU 8BIT ROMLESS 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
689
MC68HC11D0CFBE3MC68HC11D0CFBE3NXP SemiconductorsIC MCU 8BIT ROMLESS 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
269
MC68HC11D0CFNE2MC68HC11D0CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,515
MC68HC11D0CFNE3MC68HC11D0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
633
MC68HC11D0CFNE3RMC68HC11D0CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
316
MC68HC11E0CFN2MC68HC11E0CFN2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
533
MC68HC11E0CFNE2MC68HC11E0CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,449

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