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Total Products: 18,739
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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D6417709SF100BV
D6417709SF100BVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.55V ~ 1.95V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
775
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D6417709SF133BV
D6417709SF133BVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 2.05V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,414
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D6417709SHF200BV
D6417709SHF200BVRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 2.15V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
391
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N/A
D6417709SHX200BVRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 2.15V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
1,647
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D6417729RF133BV
D6417729RF133BVRenesasIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
327
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N/AN/AD6417729RHX200BVRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-3 DSP
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 2.15V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
211
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D6417750RBA240HVU0
D6417750RBA240HVU0RenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
745
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D6417751RBA240HVU0
D6417751RBA240HVU0RenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
796
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D6417751RBP200DV
D6417751RBP200DVRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
17
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N/A
D6417751RF200DDVRenesasMCU 32-BIT SUPERH RISC ROMLESSMicrocontrollersN/AN/AN/A
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Program Memory Type:
ROMless
RAM Size:
48K x 8
299
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D6417760BL200ADV
D6417760BL200ADVRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
69
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
909
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N/A
D6417760BL200ADVTRRenesasIC MCU 32BIT ROMLESS 256LFBGAMicrocontrollers256-LFBGA (17x17)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
Peripherals:
DMA, LCD, POR, WDT
Number of I/O:
69
Program Memory Type:
ROMless
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LFBGA (17×17)
Package / Case:
256-LFBGA
992
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D64F3337YFLH16V
D64F3337YFLH16VRenesasIC MCU 8BIT 60KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
Host Interface, I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
292
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D64F3437TFLH16V
D64F3437TFLH16VRenesasIC MCU 8BIT 60KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
Host Interface, I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
1,001
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N/A
D72246FA20VRenesasIC MCUMicrocontrollersN/AN/AN/A

N/A

690
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N/A
D72246TE20IVRenesasD72246 - 16-BIT H8S MCUMicrocontrollersN/AN/AN/A

N/A

717
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D73032F18V
D73032F18VRenesasMCU H8/300H / H8/3032MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Connectivity:
SCI
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
945
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D73032VX8V
D73032VX8VRenesasMCU H8/300H / H8/3032MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Connectivity:
SCI
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
1,259
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D73032X16V
D73032X16VRenesasMCU H8/300H / H8/3032MicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Connectivity:
SCI
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
201
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D73042F12V
D73042F12VRenesasMCU , 16-BIT, H8/300H CPUMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Connectivity:
SCI
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
1,516
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