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Total Products: 18,739
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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HD6417750F167
HD6417750F167RenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
506
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HD6417750RBP200V
HD6417750RBP200VRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
1,409
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HD6417750RF200DV
HD6417750RF200DVRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,175
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HD6417750RF200V
HD6417750RF200VRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
972
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HD6417750RX200DV
HD6417750RX200DVRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
643
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HD6417750RX200V
HD6417750RX200VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
189
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HD6417750RX240DV
HD6417750RX240DVRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
10
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HD6417750RX240V
HD6417750RX240VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
640
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HD6417750SF200V
HD6417750SF200VRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 2.07V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,188
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HD6417750SVF133V
HD6417750SVF133VRenesasIC MCU 32BIT ROMLESS 208HQFPMicrocontrollers208-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.7V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-HQFP (28×28)
Package / Case:
208-BFQFP Exposed Pad
1,264
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HD6417750SVX133VN/AHD6417750SVX133VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
133MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.7V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
211
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N/AN/AHD6417750SX167VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
1,338
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N/AN/AHD6417750SX200VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 2.07V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
511
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N/AN/AHD6417750X167VRenesasIC MCU 32BIT ROMLESS 208QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
167MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
28
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
1.6V ~ 2V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
631
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QUOTE
HD6417751RBP200
HD6417751RBP200RenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
872
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HD6417751RBP200V
HD6417751RBP200VRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
754
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HD6417751RBP240D
HD6417751RBP240DRenesasIC MCU 32BIT ROMLESS 256BGAMicrocontrollers256-BGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (27×27)
Package / Case:
256-BBGA
1,026
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N/A
HD6417751RF200VRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollers256-HQFP (28x28)N/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-HQFP (28×28)
Package / Case:
256-BFQFP Exposed Pad
46
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N/A
HD6417751RX200VRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
949
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QUOTE
HD6417751RX240V
HD6417751RX240VRenesasIC MCU 32BIT ROMLESS 256HQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
SH-4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
EBI/EMI, FIFO, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
39
Program Memory Type:
ROMless
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
1.4V ~ 1.6V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
746
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