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Total Products: 18,739
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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R7F7017113ABG-C#AC1
R7F7017113ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.03M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
635
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N/A
R7F7017113ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
651
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R7F7017113ABG-C#HC1
R7F7017113ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
992K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
1,834
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R7F7017114ABG-C#AC1
R7F7017114ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
918
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N/A
R7F7017114ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 233FPBGAMicrocontrollers233-FPBGAN/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
233-FPBGA
Package / Case:
233-BGA
609
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R7F7017114ABG-C#HC1
R7F7017114ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 223FBGAMicrocontrollers233-FBGA (15x15)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
174
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
233-FBGA (15×15)
Package / Case:
233-FBGA
1,325
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R7F7017143ABG-C#BC1
R7F7017143ABG-C#BC1RenesasIC MCU 32BIT 6MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
1,591
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R7F7017143ABG-C#HC1
R7F7017143ABG-C#HC1Renesas32BIT MCU RH850/F1KH-D8 BGA324Microcontrollers324-FBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
6MB (6M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
896K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38×10, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
481
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R7F7017153ABG-C#AC1
R7F7017153ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, FIFO, FlexRay, I2C, LINbus, SENT, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1.03M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
149
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R7F7017153ABG-C#BC1
R7F7017153ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 324BGAMicrocontrollers324-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-BGA
Package / Case:
324-BGA
113
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R7F7017153ABG-C#HC1
R7F7017153ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 324BGAMicrocontrollers324-BGAN/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
1M x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
324-BGA
Package / Case:
324-BGA
1,475
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R7F7017154ABG-C#AC1
R7F7017154ABG-C#AC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
744
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R7F7017154ABG-C#BC1
R7F7017154ABG-C#BC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
91
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R7F7017154ABG-C#HC1
R7F7017154ABG-C#HC1RenesasIC MCU 32BIT 8MB FLASH 324FBGAMicrocontrollers324-FBGA (19x19)N/A-40°C ~ 125°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit Dual-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, Ethernet, I2C, LINbus, SENT, SPI, UART/USART
Peripherals:
DMA, LVD, PWM, WDT
Number of I/O:
246
Program Memory Size:
8MB (8M x 8)
Program Memory Type:
FLASH
EEPROM Size:
256K x 8
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
324-FBGA (19×19)
Package / Case:
324-FBGA
294
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R7F7017603AFP-C#BA1
R7F7017603AFP-C#BA1RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
75
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
357
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R7F7017603AFP-C#KA1
R7F7017603AFP-C#KA1Renesas32BIT MCU RH850/F1KM-S2 2MB LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
75
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
828
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R7F7017623AFP-C#BA1
R7F7017623AFP-C#BA1RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 22x10b, 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
480
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QUOTE
R7F7017623AFP-C#KA1
R7F7017623AFP-C#KA1Renesas32BIT MCU RH850/F1KM-S2 2MB LQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 22x10b, 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,360
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R7F7017643AFP-C#BA1
R7F7017643AFP-C#BA1RenesasIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
430
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QUOTE
R7F7017643AFP-C#KA1
R7F7017643AFP-C#KA1Renesas32BIT MCU RH850/F1KM-S2 2MB LQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
RH850G3KH
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
144
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
376
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