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Total Products: 18,739
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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R7FA6E10D2CNE#AA0
R7FA6E10D2CNE#AA0RenesasIC MCU 32BIT 512KB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, MMC/SD, SCI, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 5x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
65
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N/A
R7FA6E10D2CNE#BA0RenesasMCU RA6 ARM CM33 200MHZ 512K/256Microcontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, MMC/SD, SCI, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 5x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,732
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R7FA6E10F2CFM#AA0
R7FA6E10F2CFM#AA0RenesasRA_FAMILY-2Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, MMC/SD, QSPI, SCI, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
814
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R7FA6E10F2CFM#AA5
R7FA6E10F2CFM#AA5RenesasMCU RA6 ARM CM33 200MHZ 512K/256Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, MMC/SD, QSPI, SCI, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
441
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R7FA6E10F2CFM#BA0
R7FA6E10F2CFM#BA0RenesasMCU RA6 ARM CM33 200MHZ 1M/256KMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, MMC/SD, QSPI, SCI, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 7x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
782
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R7FA6E10F2CFP#AA0
R7FA6E10F2CFP#AA0RenesasMCU RA6 ARM CM33 200MHZ 1M/256KMicrocontrollersN/AN/AN/A

N/A

681
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R7FA6E10F2CFP#AA5
R7FA6E10F2CFP#AA5RenesasMCU RA6 ARM CM33 200MHZ 1M/256KMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
75
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
977
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R7FA6E10F2CFP#BA0
R7FA6E10F2CFP#BA0RenesasMCU RA6 ARM CM33 200MHZ 1M/256KMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
75
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,376
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R7FA6E10F2CFP#HA0
R7FA6E10F2CFP#HA0RenesasMCU RA6 ARM CM33 200MHZ 1M/256KMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
75
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 11x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
984
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R7FA6E10F2CNE#AA0
R7FA6E10F2CNE#AA0RenesasIC MCU 32BIT 1MB FLASH 48HWQFNMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, MMC/SD, SCI, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 5x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
369
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QUOTE
N/A
R7FA6E10F2CNE#BA0RenesasMCU RA6 ARM CM33 200MHZ 1M/256KMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, MMC/SD, SCI, SmartCard, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
8K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 5x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
487
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N/A
R7FA6E2B92CBB#BC0RenesasMCU:RAMicrocontrollers64-LFBGA (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (5×5)
Package / Case:
64-LFBGA
1,417
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QUOTE
N/A
R7FA6E2B92CBC#BC0RenesasMCU:RAMicrocontrollers36-LFBGA (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 4x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-LFBGA (4×4)
Package / Case:
36-LFBGA
444
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QUOTE
N/A
R7FA6E2B93CBB#BC0RenesasMCU RA6 ARM CM33 200MHZ 128K/40KMicrocontrollers64-LFBGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (5×5)
Package / Case:
64-LFBGA
741
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QUOTE
N/A
R7FA6E2B93CBC#BC0RenesasMCU RA6 ARM CM33 200MHZ 128K/40KMicrocontrollers36-LFBGA (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, I2C, QSPI, SCI, SPI, SSIE, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 4x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-LFBGA (4×4)
Package / Case:
36-LFBGA
1,300
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QUOTE
R7FA6E2B93CFM#AA0
R7FA6E2B93CFM#AA0RenesasMCU:RAMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,008
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QUOTE
R7FA6E2B93CFM#BA0
R7FA6E2B93CFM#BA0RenesasMCU:RAMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
223
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QUOTE
R7FA6E2B93CNE#BA0
R7FA6E2B93CNE#BA0RenesasMCU:RAMicrocontrollers48-HWQFN (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-HWQFN (7×7)
Package / Case:
48-WFQFN Exposed Pad
1,193
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QUOTE
R7FA6E2B93CNH#BA0
R7FA6E2B93CNH#BA0RenesasMCU:RAMicrocontrollers32-HWQFN (5x5)N/A-40°C ~ 125°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 5x12b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HWQFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
1,181
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QUOTE
N/A
R7FA6E2BB2CBB#BC0RenesasMCU:RAMicrocontrollers64-LFBGA (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI, UART/USART, USB
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 12x12b SAR; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (5×5)
Package / Case:
64-LFBGA
368
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QUOTE

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