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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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LPC2388FBD144,551
LPC2388FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,193
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LPC2388FBD144K
LPC2388FBD144KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
516
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LPC2420FBD208,551
LPC2420FBD208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
82K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
531
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LPC2420FBD208K
LPC2420FBD208KNXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
82K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
890
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LPC2420FET208,551
LPC2420FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
82K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
649
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LPC2458FET180,551
LPC2458FET180,551NXP SemiconductorsIC MCU 16/32BIT 512KB 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,335
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LPC2460FBD208,551
LPC2460FBD208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,694
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LPC2460FET208,551
LPC2460FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
916
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N/A
LPC2460FET208YNXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7TDMI-S
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
1,901
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LPC2468FBD208,551
LPC2468FBD208,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
593
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LPC2468FBD208K
LPC2468FBD208KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
315
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LPC2468FET208,551
LPC2468FET208,551NXP SemiconductorsIC MCU 16/32BIT 512KB 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
76
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LPC2468FET208K
LPC2468FET208KNXP SemiconductorsIC MCU 16/32BIT 512KB 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
812
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LPC2470FBD208,551
LPC2470FBD208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
115
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LPC2470FET208,551
LPC2470FET208,551NXP SemiconductorsIC MCU 16/32BIT ROMLESS 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Type:
ROMless
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
412
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LPC2478FBD208,551
LPC2478FBD208,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
619
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LPC2478FBD208K
LPC2478FBD208KNXP SemiconductorsIC MCU 16/32B 512KB FLSH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
98K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
461
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LPC2478FET208,551
LPC2478FET208,551NXP SemiconductorsIC MCU 16/32BIT 512KB 208TFBGAMicrocontrollers208-TFBGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM7®
Core Size:
16/32-Bit
Speed:
72MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
160
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-TFBGA (15×15)
Package / Case:
208-TFBGA
712
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LPC2917FBD144,551
LPC2917FBD144,551NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
637
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QUOTE
LPC2917FBD144/01/,
LPC2917FBD144/01/,NXP SemiconductorsIC MCU 16/32B 512KB FLSH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM9®
Core Size:
16/32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
108
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
58
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QUOTE

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