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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/A
MC68F375BGMZP33NXP SemiconductorsIC MCU 32BIT 256KB FLASH 217PBGAMicrocontrollers217-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
33MHz
Connectivity:
CANbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
217-PBGA (23×23)
Package / Case:
217-BBGA
218
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N/A
MC68F375MZP33R2NXP SemiconductorsIC MCU 32BIT 256KB FLASH 217PBGAMicrocontrollers217-PBGA (23x23)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
33MHz
Connectivity:
CANbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
217-PBGA (23×23)
Package / Case:
217-BBGA
201
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MC68HC11A0CFNE3
MC68HC11A0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
395
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MC68HC11A1CFNE3
MC68HC11A1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
415
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MC68HC11A1CFNE3R
MC68HC11A1CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
321
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MC68HC11A1MFNE
MC68HC11A1MFNENXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
814
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MC68HC11A1MFNER
MC68HC11A1MFNERNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
201
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MC68HC11D0CFBE2
MC68HC11D0CFBE2NXP SemiconductorsIC MCU 8BIT ROMLESS 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
971
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MC68HC11D0CFBE3
MC68HC11D0CFBE3NXP SemiconductorsIC MCU 8BIT ROMLESS 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
991
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MC68HC11D0CFNE2
MC68HC11D0CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
201
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MC68HC11D0CFNE3
MC68HC11D0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
665
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MC68HC11D0CFNE3R
MC68HC11D0CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
26
Program Memory Type:
ROMless
RAM Size:
192 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,310
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MC68HC11E0CFN2
MC68HC11E0CFN2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,269
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MC68HC11E0CFNE2
MC68HC11E0CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,321
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MC68HC11E0CFNE2R
MC68HC11E0CFNE2RNXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
905
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MC68HC11E0CFNE3
MC68HC11E0CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
244
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MC68HC11E0CFNE3R
MC68HC11E0CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
610
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MC68HC11E0MFNE2
MC68HC11E0MFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 125°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,260
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MC68HC11E1CFN2
MC68HC11E1CFN2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
519
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MC68HC11E1CFN2R2
MC68HC11E1CFN2R2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,811
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