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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MC68HCP11E1CFNE2
MC68HCP11E1CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,035
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MC68HCP11E1CFNE3
MC68HCP11E1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
979
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MC68HRC705KJ1CP
MC68HRC705KJ1CPNXP SemiconductorsIC MCU 8BIT 1.2KB OTP 16DIPMicrocontrollers16-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4.2MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
16-PDIP
Package / Case:
16-DIP (0.300″”, 7.62mm)
80
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MC68HRC908JK1CDWN/AMC68HRC908JK1CDWNXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,658
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MC68HRC908JK1CPN/AMC68HRC908JK1CPNXP SemiconductorsIC MCU 8BIT 1.5KB FLASH 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
1.5KB (1.5K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
750
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MC68HRC908JK3CDWN/AMC68HRC908JK3CDWNXP SemiconductorsIC MCU 8BIT 4KB FLASH 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,200
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MC68HRC908JK3CPN/AMC68HRC908JK3CPNXP SemiconductorsIC MCU 8BIT 4KB FLASH 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
352
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MC68HRC98JL3ECDW
MC68HRC98JL3ECDWNXP SemiconductorsIC MCU 8BIT 4KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LED, LVD, POR, PWM
Number of I/O:
15
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.3V
Data Converters:
A/D 12x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,591
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MC68HSC705J1ACPE
MC68HSC705J1ACPENXP SemiconductorsIC MCU 8BIT 1.2KB OTP 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
192
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MC68HSR705J1ACPE
MC68HSR705J1ACPENXP SemiconductorsIC MCU 8BIT 1.2KB OTP 20DIPMicrocontrollers20-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-DIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
436
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MC68L11E1CFNE2
MC68L11E1CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
713
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MC68L11E1FNE2
MC68L11E1FNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A0°C ~ 70°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
39
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MC68L11F1CFNE3
MC68L11F1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
344
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MC68L11K1FUE2
MC68L11K1FUE2NXP SemiconductorsIC MCU 8BIT ROMLESS 80QFPMicrocontrollers80-QFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
37
Program Memory Type:
ROMless
EEPROM Size:
640 x 8
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
929
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MC68LK332ACAG16
MC68LK332ACAG16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16.78MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
221
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MC68LK332ACEH16
MC68LK332ACEH16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16.78MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
1,057
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MC68LK332ACPV16
MC68LK332ACPV16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16.78MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
35
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MC68LK332GCAG16
MC68LK332GCAG16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
16
Program Memory Type:
ROMless
RAM Size:
2K x 8
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
368
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MC68LK332GCEH16
MC68LK332GCEH16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16.78MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
991
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MC68LK332GCPV16
MC68LK332GCPV16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16.78MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
836
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