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Total Products: 76,307
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
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MC68S711E9CFN2
MC68S711E9CFN2NXP SemiconductorsIC MCU 8BIT 12KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
752
MC68S711E9CFNE2
MC68S711E9CFNE2NXP SemiconductorsIC MCU 8BIT 12KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
38
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
OTP
EEPROM Size:
512 x 8
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
259
MC705B16NBE
MC705B16NBENXP SemiconductorsIC MCU 8BIT 15KB OTP 56PSDIPMicrocontrollers56-PSDIPN/A0°C ~ 70°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
56-PSDIP
Package / Case:
56-SDIP (0.600″”, 15.24mm)
1,787
MC705B16NCBE
MC705B16NCBENXP SemiconductorsIC MCU 8BIT 15KB OTP 56PSDIPMicrocontrollers56-PSDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
56-PSDIP
Package / Case:
56-SDIP (0.600″”, 15.24mm)
728
MC705B16NCFNER
MC705B16NCFNERNXP SemiconductorsIC MCU 8BIT 15KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
401
MC705C8ABE
MC705C8ABENXP SemiconductorsIC MCU 8BIT 8KB OTP 42DIPMicrocontrollers42-PDIPN/A0°C ~ 70°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
525
MC705C8ACBE
MC705C8ACBENXP SemiconductorsIC MCU 8BIT 8KB OTP 42DIPMicrocontrollers42-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
797
MC705C8ACFBEN/AMC705C8ACFBENXP SemiconductorsIC MCU 8BIT 8KB OTP 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
1,222
MC705C8ACFNERN/AMC705C8ACFNERNXP SemiconductorsIC MCU 8BIT 8KB OTP 44PLCCMicrocontrollers44-PLCC (16.59x16.59)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC (16.59×16.59)
Package / Case:
44-LCC (J-Lead)
1,097
MC705C8ACPBEN/AMC705C8ACPBENXP SemiconductorsIC MCU 8BIT 8KB OTP 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
63
MC705C8ACPE
MC705C8ACPENXP SemiconductorsIC MCU 8BIT 8KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
304 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
184
MC705C9ACPE
MC705C9ACPENXP SemiconductorsIC MCU 8BIT 16KB OTP 40DIPMicrocontrollers40-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
40-PDIP
Package / Case:
40-DIP (0.600″”, 15.24mm)
979
MC705J1ACDWE
MC705J1ACDWENXP SemiconductorsIC MCU 8BIT 1.2KB OTP 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
4MHz
Peripherals:
POR, WDT
Number of I/O:
14
Program Memory Size:
1.2KB (1.2K x 8)
Program Memory Type:
OTP
RAM Size:
64 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,200
MC705JJ7CDWE
MC705JJ7CDWENXP SemiconductorsIC MCU 8BIT 6KB OTP 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, Temp Sensor, WDT
Number of I/O:
14
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
OTP
RAM Size:
224 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,812
MC705JP7CPE
MC705JP7CPENXP SemiconductorsIC MCU 8BIT 6KB OTP 28DIPMicrocontrollers28-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, Temp Sensor, WDT
Number of I/O:
22
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
OTP
RAM Size:
224 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-PDIP
Package / Case:
28-DIP (0.600″”, 15.24mm)
997
MC705L16CFUE
MC705L16CFUENXP SemiconductorsIC MCU 8BIT 16KB OTP 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SPI
Peripherals:
LCD, POR, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
463
MC705P6ACDWE
MC705P6ACDWENXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
833
MC705P6ACDWER
MC705P6ACDWERNXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
891
MC705P6ACPE
MC705P6ACPENXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28DIPMicrocontrollers28-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
28-PDIP
Package / Case:
28-DIP (0.600″”, 15.24mm)
640
MC705P6AMDWE
MC705P6AMDWENXP SemiconductorsIC MCU 8BIT 4.5KB OTP 28SOICMicrocontrollers28-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SIO
Peripherals:
POR, WDT
Number of I/O:
21
Program Memory Size:
4.5KB (4.5K x 8)
Program Memory Type:
OTP
RAM Size:
176 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
527

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