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Total Products: 76,307
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MCF54450AVM240
MCF54450AVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,499
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MCF54450CVM180
MCF54450CVM180NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
615
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MCF54450VM240
MCF54450VM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,511
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MCF54450VM240J
MCF54450VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
448
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MCF54451CVM180
MCF54451CVM180NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
683
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MCF54451VM240
MCF54451VM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,281
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MCF54451VM240J
MCF54451VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
287
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MCF54452CVP200
MCF54452CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
432
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MCF54452CVR200
MCF54452CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
518
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MCF54452VP266
MCF54452VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,221
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MCF54452VP266R
MCF54452VP266RNXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
434
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MCF54452VR266
MCF54452VR266NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
622
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MCF54452VR266R
MCF54452VR266RNXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
213
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MCF54453CVP200
MCF54453CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,822
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QUOTE
MCF54453CVR200
MCF54453CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
1,188
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MCF54453VP266
MCF54453VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
809
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QUOTE
MCF54453VR266
MCF54453VR266NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
1,619
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QUOTE
MCF54454CVP200
MCF54454CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
577
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QUOTE
MCF54454CVR200
MCF54454CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
285
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MCF54454VP266
MCF54454VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
57
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