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Suntsu Electronics is your reliable source for hard-to-find and obsolete electronic components. Our advanced part search tool makes it easy to quickly find the products you need. You can search by part number, manufacturer, or specifications to instantly access a comprehensive database of electronic components.

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Total Products: 76,308
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MCF54450ACVM180
MCF54450ACVM180NXP SemiconductorsMCF5445x - 32-bit MPU, ColdFireMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ColdFire V4
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
93
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 1.65V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,948
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MCF54450AVM240
MCF54450AVM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,209
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MCF54450CVM180
MCF54450CVM180NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
219
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MCF54450VM240
MCF54450VM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,282
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MCF54450VM240J
MCF54450VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
206
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MCF54451CVM180
MCF54451CVM180NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
845
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MCF54451VM240
MCF54451VM240NXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
976
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MCF54451VM240J
MCF54451VM240JNXP SemiconductorsIC MCU 32BIT ROMLESS 256MAPBGAMicrocontrollers256-MAPBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-MAPBGA (17×17)
Package / Case:
256-LBGA
1,722
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MCF54452CVP200
MCF54452CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
82
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MCF54452CVR200
MCF54452CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
295
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MCF54452VP266
MCF54452VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,389
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MCF54452VP266R
MCF54452VP266RNXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
426
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MCF54452VR266
MCF54452VR266NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
551
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MCF54452VR266R
MCF54452VR266RNXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
471
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MCF54453CVP200
MCF54453CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
1,205
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MCF54453CVR200
MCF54453CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
977
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MCF54453VP266
MCF54453VP266NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
393
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MCF54453VR266
MCF54453VR266NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
266MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
1,591
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MCF54454CVP200
MCF54454CVP200NXP SemiconductorsIC MCU 32BIT ROMLESS 360BGAMicrocontrollers360-BGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-BGA (23×23)
Package / Case:
360-BBGA
381
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MCF54454CVR200
MCF54454CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 360TEPBGAMicrocontrollers360-TEPBGA (23x23)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
I2C, SPI, SSI, UART/USART, USB OTG
Peripherals:
DMA, WDT
Number of I/O:
132
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.35V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
360-TEPBGA (23×23)
Package / Case:
360-BBGA
217
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