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Total Products: 76,308
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MCF5480CZP166
MCF5480CZP166NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
804
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MCF5481CVR166
MCF5481CVR166NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,576
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MCF5482CVR166
MCF5482CVR166NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
907
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MCF5482CZP166
MCF5482CZP166NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
580
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MCF5483CVR166
MCF5483CVR166NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
166MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,185
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MCF5484CVR200
MCF5484CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
1,808
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MCF5484CZP200
MCF5484CZP200NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
462
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MCF5485CVR200
MCF5485CVR200NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
892
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MCF5485CZP200
MCF5485CZP200NXP SemiconductorsIC MCU 32BIT ROMLESS 388PBGAMicrocontrollers388-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V4E
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.43V ~ 1.58V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
388-PBGA (27×27)
Package / Case:
388-BBGA
251
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MCHC11F1CFNE2
MCHC11F1CFNE2NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
42
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MCHC11F1CFNE2R
MCHC11F1CFNE2RNXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
2MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
472
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MCHC11F1CFNE3
MCHC11F1CFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
324
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MCHC11F1CFNE3R
MCHC11F1CFNE3RNXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
272
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MCHC11F1CFNE4
MCHC11F1CFNE4NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
264
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MCHC11F1CFNE4R
MCHC11F1CFNE4RNXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
930
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MCHC11F1CFNE5
MCHC11F1CFNE5NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 85°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
1,876
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MCHC11F1VFNE3
MCHC11F1VFNE3NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
3MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
395
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MCHC11F1VFNE4N/AMCHC11F1VFNE4NXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
360
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MCHC11F1VFNE4RN/AMCHC11F1VFNE4RNXP SemiconductorsIC MCU 8BIT ROMLESS 68PLCCMicrocontrollers68-PLCC (24.21x24.21)N/A-40°C ~ 105°C (TA)
Core Processor:
HC11
Core Size:
8-Bit
Speed:
4MHz
Connectivity:
SCI, SPI
Peripherals:
POR, WDT
Number of I/O:
30
Program Memory Type:
ROMless
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-PLCC (24.21×24.21)
Package / Case:
68-LCC (J-Lead)
952
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MCHC705B16NCFNE
MCHC705B16NCFNENXP SemiconductorsIC MCU 8BIT 15KB OTP 52PLCCMicrocontrollers52-PLCC (19.1x19.1)N/A-40°C ~ 85°C (TA)
Core Processor:
HC05
Core Size:
8-Bit
Speed:
2.1MHz
Connectivity:
SCI
Peripherals:
POR, WDT
Number of I/O:
32
Program Memory Size:
15KB (15K x 8)
Program Memory Type:
OTP
EEPROM Size:
256 x 8
RAM Size:
352 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
52-PLCC (19.1×19.1)
Package / Case:
52-LCC (J-Lead)
1,280
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